Various embodiments comprise a laser bonded glass-silicon vapor cell for performing spectroscopy on particles like atoms or molecules. In some examples, the laser bonded glass-silicon vapor cell comprises a glass base, a glass top, a silicon piece, and a filling material. The silicon piece comprises at least one through hole. The lower surface of the silicon piece is hermetically bonded to the glass base. The upper surface of the silicon piece is laser bonded to the glass top. The filling material is positioned in a cavity formed by the through hole, the glass base, and the glass top. The filling material may comprise an alkali metal, a salt slush, an inert gas, or a vacuum encapsulation.

The invention relates to a method for theiiiially stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

A method of assembling together a first part and at least one second part that are made of materials compatible with bonding by molecular adhesion includes a step of pressing a first surface of the first part against a second surface of the second part so as to create molecular bonds at an interface between the parts, and a step of consolidating the interface bonding as created in this way by heat treatment. The consolidation includes a step of emitting a power laser beam towards an impact point forming a portion of the outline of the interface, and a step of moving the impact point along the outline of the interface.

A method for monitoring a laser welding process for welding two workpieces using a laser wavelength, in which a pulsed laser beam is directed into the workpieces so as to melt a melting volume in a region of an interface of the two workpieces in order to produce a weld seam, and in which an intensity of a process radiation emitted by the melting volume is detected. According to the method for monitoring the lase welding process, in a first step, a detected intensity profile is evaluated with regard to at least one of the following features: (i) a depth of an intensity decrease, (ii) a duration of an intensity decrease, and (iii) a renewed increase in intensity after an intensity decrease. In a second step it is determined whether or not a gap between the two workpieces was bridged during the laser welding process based on the evaluation.

A method for monitoring a laser welding process for welding two workpieces using a laser wavelength, in which a pulsed laser beam is directed into the workpieces so as to melt a melting volume in a region of an interface of the two workpieces in order to produce a weld seam, and in which an intensity of a process radiation emitted by the melting volume is detected. According to the method for monitoring the lase welding process, in a first step, a detected intensity profile is evaluated with regard to at least one of the following features: (i) a depth of an intensity decrease, (ii) a duration of an intensity decrease, and (iii) a renewed increase in intensity after an intensity decrease. In a second step it is determined whether or not a gap between the two workpieces was bridged during the laser welding process based on the evaluation.

An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.

An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

A method for manufacturing a mirror blank comprises: providing a primary piece of glass comprising a primary planar surface and a backing piece of glass comprising a backing planar surface; assembling a mirror blank assembly, wherein assembling the mirror blank assembly comprises interposing a plurality of glass splines between the primary glass and the backing glass. Interposing the plurality of glass splines comprises: for each glass spline, respectively abutting first and second opposed surfaces of the glass spline against the primary planar surface of the primary glass and against the backing planar surface of the backing glass. The mirror blank assembly is then heated to fuse the interposed glass splines to the primary glass and the backing glass while the primary glass and the secondary glass remain spaced apart from one another by the interposed glass splines to thereby provide the mirror blank.