Patent classifications
C03B23/20
Process for joining opaque fused quartz to clear fused quartz
Processes for fusing opaque fused quartz to clear fused quartz to form ultraviolet light transmission windows comprise surrounding a clear fused quartz ingot with an opaque fused quartz sleeve or opaque fused quartz particles, then heating the clear and opaque fused quartz together in a furnace, past the transition temperature of the opaque fused quartz, in order to join the two types of quartz together around the perimeter of the clear fused quartz ingot, but without substantial mixing beyond the interface.
Process for joining opaque fused quartz to clear fused quartz
Processes for fusing opaque fused quartz to clear fused quartz to form ultraviolet light transmission windows comprise surrounding a clear fused quartz ingot with an opaque fused quartz sleeve or opaque fused quartz particles, then heating the clear and opaque fused quartz together in a furnace, past the transition temperature of the opaque fused quartz, in order to join the two types of quartz together around the perimeter of the clear fused quartz ingot, but without substantial mixing beyond the interface.
HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER
A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.
HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER
A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.
HIGH TEMPERATURE SEALANT AND METHODS THEREOF
A method of making a stoichiometric monazite (LaPO.sub.4) composition or a mixture of LaPO.sub.4 and LaP.sub.3O.sub.9 composition, as defined herein. Also disclosed is a method of joining or sealing materials with the compositions, as defined herein.
Manufacturing method for lightweight large-size telescope mirror blanks and mirror blanks fabricated according to same
A method for manufacturing a mirror blank comprises: providing a primary piece of glass comprising a primary planar surface and a backing piece of glass comprising a backing planar surface; assembling a mirror blank assembly, wherein assembling the mirror blank assembly comprises interposing a plurality of glass splines between the primary glass and the backing glass. Interposing the plurality of glass splines comprises: for each glass spline, respectively abutting first and second opposed surfaces of the glass spline against the primary planar surface of the primary glass and against the backing planar surface of the backing glass. The mirror blank assembly is then heated to fuse the interposed glass splines to the primary glass and the backing glass while the primary glass and the secondary glass remain spaced apart from one another by the interposed glass splines to thereby provide the mirror blank.
Manufacturing method for lightweight large-size telescope mirror blanks and mirror blanks fabricated according to same
A method for manufacturing a mirror blank comprises: providing a primary piece of glass comprising a primary planar surface and a backing piece of glass comprising a backing planar surface; assembling a mirror blank assembly, wherein assembling the mirror blank assembly comprises interposing a plurality of glass splines between the primary glass and the backing glass. Interposing the plurality of glass splines comprises: for each glass spline, respectively abutting first and second opposed surfaces of the glass spline against the primary planar surface of the primary glass and against the backing planar surface of the backing glass. The mirror blank assembly is then heated to fuse the interposed glass splines to the primary glass and the backing glass while the primary glass and the secondary glass remain spaced apart from one another by the interposed glass splines to thereby provide the mirror blank.
Laser resealing with stress-reducing prestructuring
A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.
Laser resealing with stress-reducing prestructuring
A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.
Fused opaque and clear glass for camera or display window
Apparatus, systems and methods for windows integration with cover glass and for processing cover glass to provide windows for electronic devices are disclosed. Transparent windows such as a transparent camera window, a transparent illuminator window and/or a transparent display window can be integrated into the cover glass. The apparatus, systems and methods are especially suitable for cover glasses, or displays (e.g., LCD displays), assembled in small form factor electronic devices such as handheld electronic devices (e.g., mobile phones, media players, personal digital assistants, remote controls, etc.). The apparatus, systems and methods can also be used for cover glasses or displays for other relatively larger form factor electronic devices (e.g., portable computers, tablet computers, displays, monitors, televisions, etc.).