Polarizing optical devices described herein, and polarizing optical devices resulting from methods described herein, can be small and can have high heat tolerance. Wires of wire grid polarizers can be attached directly to prisms of the polarizing optical devices, allowing for small size. Multiple polarizing optical devices can be attached by adhesive-free bonding techniques, allowing high heat tolerance.

Polarizing optical devices described herein, and polarizing optical devices resulting from methods described herein, can be small and can have high heat tolerance. Wires of wire grid polarizers can be attached directly to prisms of the polarizing optical devices, allowing for small size. Multiple polarizing optical devices can be attached by adhesive-free bonding techniques, allowing high heat tolerance.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

Bead removal apparatus and methods of separating beads from glass sheets with glass engaging units are disclosed. The bead removal apparatus includes a forming body from which a continuous glass ribbon is drawn in a draw direction and a bead removal station adjacent to and laterally offset from the forming body. The bead removal station includes a heating element configured to heat a desired line of bead separation of a glass sheet to a temperature within a range of about 400 C. to about 600 C., and a crack initiation device configured to initiate a crack in the glass sheet at the desired line of bead separation. The bead removal apparatus further includes a glass engaging unit configured to move the glass sheet from the continuous glass ribbon to the bead removal station.

Bead removal apparatus and methods of separating beads from glass sheets with glass engaging units are disclosed. The bead removal apparatus includes a forming body from which a continuous glass ribbon is drawn in a draw direction and a bead removal station adjacent to and laterally offset from the forming body. The bead removal station includes a heating element configured to heat a desired line of bead separation of a glass sheet to a temperature within a range of about 400 C. to about 600 C., and a crack initiation device configured to initiate a crack in the glass sheet at the desired line of bead separation. The bead removal apparatus further includes a glass engaging unit configured to move the glass sheet from the continuous glass ribbon to the bead removal station.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Apparatuses and methods for heating moving continuous glass ribbons at desired lines of separation and/or for separating glass sheets from continuous glass ribbons are disclosed. An apparatus includes a translatable support portion and a heating apparatus coupled to the support portion. The heating apparatus is configured to contact the continuous glass ribbon across at least a portion of a width of the continuous glass ribbon at the desired line of separation as the support portion moves in a draw direction, thereby preferentially applying heat to a first side of the continuous glass ribbon at the desired line of separation as the continuous glass ribbon moves in the draw direction.

In a method of manufacturing a glass interposer, first, stacked bodies formed on a front surface and a back surface of a glass substrate are processed along division lines (streets) to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves. Thereafter, the residual resin portion is subjected to ablation processing to expose the front surface and the back surface of the glass substrate, thereby forming second grooves having a second width narrower than the first width. A laser beam is applied along the division lines through the second grooves to form modified layers in the inside of the glass substrate, and an external force is exerted on the glass substrate to divide the glass substrate, with the modified layers as division starting points.