Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis.

Systems and methods are described for forming continuous curved laser filaments in transparent materials. The filaments are preferably curved and C-shaped. Filaments may employ other curved profiles (shapes). A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths in the range of 100 μm-10 mm. An aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.

A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

A method of processing a glass laminate substrate includes carrying a glass laminate substrate including a glass substrate on a metal substrate to a processing location; radiating a laser onto the metal substrate through the glass substrate; and cooling a portion of the glass substrate, through which the laser is radiated, such that the glass substrate is cut at the portion through which the laser is radiated. When methods of processing and cutting a glass laminate substrate and an apparatus for processing a glass laminate substrate, according to embodiments, are used, a glass laminate substrate having high edge strength after cutting may be produced.

A method of processing a transparent member, the transparent member having a first surface extending perpendicularly to the direction of laser light emission, and a second surface and a third surface that are connected to the first surface, the method including emitting laser light in the direction perpendicular to the first surface, and scanning the laser light in the direction parallel to the first surface, wherein the second surface of the transparent member is an inclined surface, or an inclined surface is disposed on the same side of the transparent member as the second surface, and, by causing the laser light to reflect on the inclined surface toward the third surface, a modified region is formed in a region having up to 2 mm depth from the third surface from the first surface to the lower end of the third surface in the direction of laser light emission.

A manufacturing method of a glass article having an organic film includes irradiating a first main surface of a glass plate having the first main surface and a second main surface, opposite each other, with a laser light of a first laser, to form an in-plane void region, in which voids are arrayed, on the first main surface, and internal void arrays, including voids arrayed from the in-plane void region to the second main surface, in the glass plate; depositing the organic film on the first main surface or the second main surface of the glass plate; and irradiating and scanning the first main surface or the second main surface, on which the organic film was deposited, with a laser light of a second laser, along the in-plane void region, to separate the glass article from the glass plate along the in-plane void region.

A manufacturing method of a glass article having an organic film includes irradiating a first main surface of a glass plate having the first main surface and a second main surface, opposite each other, with a laser light of a first laser, to form an in-plane void region, in which voids are arrayed, on the first main surface, and internal void arrays, including voids arrayed from the in-plane void region to the second main surface, in the glass plate; depositing the organic film on the first main surface or the second main surface of the glass plate; and irradiating and scanning the first main surface or the second main surface, on which the organic film was deposited, with a laser light of a second laser, along the in-plane void region, to separate the glass article from the glass plate along the in-plane void region.

A method is disclosed for dividing a composite material 10 including a brittle material layer 1 and a resin layer 2 that are laminated together, the method includes: a resin removing step of applying laser light L1 oscillated from a CO.sub.2 laser light source 20 to the resin layer along a planned division line DL of the composite material, so that a processed groove 24 is formed along the planned division line; and a brittle material removing step of applying, after the resin removing step, laser light L2 oscillated from an ultrashort pulsed laser light source 30 to the brittle material layer along the planned division line, so that processed marks 11 are formed along the planned division line. The processed marks formed in the brittle material removing step open on the resin layer side and do not penetrate through the brittle material layer.