Provided is a glass composition comprising a glass frit containing P.sub.2O.sub.5, BaO, ZnO, group I-based oxide and group II-based oxide, wherein the P.sub.2O.sub.5 is contained in an amount of 20 wt % to 55 wt % based on a total weight of the glass frit, wherein each of the BaO and ZnO is contained in an amount of 2 to 30% by weight based on the total weight of the glass frit, wherein the group I-based oxide is contained in an amount of 5 to 20% by weight based on the total weight of the glass frit, wherein the group II-based oxide is contained in an amount of 1 to 15% by weight based on the total weight of the glass frit.

Methods for producing glass articles from laminated glass tubing include introducing the glass tubing to a converter. The glass tubing includes a core layer under tensile stress, an outer clad layer under, and an inner clad layer. The methods include forming a feature the glass article at a working end of the laminated glass tubing and separating a glass article from the working end of the laminated glass tubing, which may expose the core layer under tensile stress at the working end of the glass tubing. The method further comprises remediating the exposed portion of the core layer by completely enclosing the core layer in a clad layer. Systems for re-cladding the exposed portion of the core layer as well as glass articles made using the systems and methods are also disclosed.

Methods for producing glass articles from laminated glass tubing include introducing the glass tubing to a converter. The glass tubing includes a core layer under tensile stress, an outer clad layer under, and an inner clad layer. The methods include forming a feature the glass article at a working end of the laminated glass tubing and separating a glass article from the working end of the laminated glass tubing, which may expose the core layer under tensile stress at the working end of the glass tubing. The method further comprises remediating the exposed portion of the core layer by completely enclosing the core layer in a clad layer. Systems for re-cladding the exposed portion of the core layer as well as glass articles made using the systems and methods are also disclosed.

A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.

Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

A glass article includes lithium aluminosilicate, includes a first surface, a second surface opposed to the first surface, a first compressive region extending from the first surface to a first compression depth, a second compressive region extending from the second surface to a second compression depth, and, a tensile region disposed between the first compression depth and the second compression depth, where a stress profile of the first compressive region has a first local minimum point at which the stress profile is convex downward and a first local maximum point at which the stress profile is convex upward, where a depth of the first local maximum point is greater than a depth of the first local minimum point, and where a stress of the first local maximum point is greater than a compressive stress of the first local minimum point.

The invention relates to a process for manufacturing a microfluidic chip comprising a solid material obtained from a sol-gel solution, the process comprising successively: a) casting a sol-gel solution made with tetraethyl orthosilicate onto a mold presenting a relief pattern and having a different thickness over the whole of the mold; b) gelling the sol-gel solution; c) unmolding and drying the gel obtained in b), so as to obtain a solid glass; and d) bonding said solid glass to a support, so as to obtain the microfluidic chip.

The invention relates to a process for manufacturing a microfluidic chip comprising a solid material obtained from a sol-gel solution, the process comprising successively: a) casting a sol-gel solution made with tetraethyl orthosilicate onto a mold presenting a relief pattern and having a different thickness over the whole of the mold; b) gelling the sol-gel solution; c) unmolding and drying the gel obtained in b), so as to obtain a solid glass; and d) bonding said solid glass to a support, so as to obtain the microfluidic chip.

A method may include performing an active alignment to enable optical coupling between a first optical fiber and a second optical fiber via an imaging structure. An end of the first optical fiber may be at a first location on a first surface of the imaging structure. The first location may be a first transverse offset distance from an axis of the imaging structure. An end of the second optical fiber may be at a second location of the first surface of the imaging structure. The second location may be a second transverse offset distance from the axis of the imaging structure. The method may include fusion splicing the end of the first optical fiber at the first location on the first surface of the imaging structure, and fusion splicing the end of the second optical fiber at the second location on the first surface of the imaging structure.

A method may include performing an active alignment to enable optical coupling between a first optical fiber and a second optical fiber via an imaging structure. An end of the first optical fiber may be at a first location on a first surface of the imaging structure. The first location may be a first transverse offset distance from an axis of the imaging structure. An end of the second optical fiber may be at a second location of the first surface of the imaging structure. The second location may be a second transverse offset distance from the axis of the imaging structure. The method may include fusion splicing the end of the first optical fiber at the first location on the first surface of the imaging structure, and fusion splicing the end of the second optical fiber at the second location on the first surface of the imaging structure.