C03C3/04

ION EXCHANGEABLE GLASS WITH HIGH CRACK INITIATION THRESHOLD
20200180999 · 2020-06-11 ·

Alkali aluminosilicate glasses that are resistant to damage due to sharp impact and capable of fast ion exchange are provided. The glasses comprise at least 4 mol % P.sub.2O.sub.5 and, when ion exchanged, have a Vickers indentation crack initiation load of at least about 7 kgf.

High Frequency Ultrasonic Transducer and Method of Fabrication
20200171544 · 2020-06-04 ·

An ultrasonic transducer that includes a delay line, a piezoelectric element, and a metal conductive layer between the delay line and the piezoelectric element. The delay line and the piezoelectric element are acoustically joined with an atomic diffusion bond to facilitate coupling ultrasonic waves from the piezoelectric element into the delay line or from the delay line into the piezoelectric element.

High Frequency Ultrasonic Transducer and Method of Fabrication
20200171544 · 2020-06-04 ·

An ultrasonic transducer that includes a delay line, a piezoelectric element, and a metal conductive layer between the delay line and the piezoelectric element. The delay line and the piezoelectric element are acoustically joined with an atomic diffusion bond to facilitate coupling ultrasonic waves from the piezoelectric element into the delay line or from the delay line into the piezoelectric element.

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

Dissolvable sealant for masking glass in high temperature ion exchange baths

A method of masking glass in an ion exchange bath includes applying a dissolvable sealant to a cover material, adhering the cover material to a glass part to form a mask on the glass part, immersing the glass part into an ion exchange bath. removing the glass part from the ion exchange bath, and using a solvent to dissolve the sealant and the cover material from the glass part. A mask on glass having a piece of glass, and a dissolvable sealant on a cover material, the dissolvable sealant comprising an inorganic material and a silicate, the dissolvable sealant between the cover material and the piece of glass.

Dissolvable sealant for masking glass in high temperature ion exchange baths

A method of masking glass in an ion exchange bath includes applying a dissolvable sealant to a cover material, adhering the cover material to a glass part to form a mask on the glass part, immersing the glass part into an ion exchange bath. removing the glass part from the ion exchange bath, and using a solvent to dissolve the sealant and the cover material from the glass part. A mask on glass having a piece of glass, and a dissolvable sealant on a cover material, the dissolvable sealant comprising an inorganic material and a silicate, the dissolvable sealant between the cover material and the piece of glass.

AUTOMOTIVE LAMINATE WITH HOLE

Laminated glazing, once limited to just the windshield, is finding more and more application in other positions on the vehicle due to its ability to improve passenger safety, security and comfort. Problems are encountered when producing a laminated version of a tempered part with holes, because tempered glass is 4 to 5 times stronger than annealed glass. The laminate of the invention has a hole in the exterior glass layer. An insert is bonded to a cutout in the area of the hole on the interior glass layer so as to reinforce the hole and distribute the load over a wider area. The result is a laminated glazing with one or more holes that has the reliability of and is a direct replacement for a tempered part.

FIBER COUPLER

A method may include performing an active alignment to enable optical coupling between a first optical fiber and a second optical fiber via an imaging structure. An end of the first optical fiber may be at a first location on a first surface of the imaging structure. The first location may be a first transverse offset distance from an axis of the imaging structure. An end of the second optical fiber may be at a second location of the first surface of the imaging structure. The second location may be a second transverse offset distance from the axis of the imaging structure. The method may include fusion splicing the end of the first optical fiber at the first location on the first surface of the imaging structure, and fusion splicing the end of the second optical fiber at the second location on the first surface of the imaging structure.

FIBER COUPLER

A method may include performing an active alignment to enable optical coupling between a first optical fiber and a second optical fiber via an imaging structure. An end of the first optical fiber may be at a first location on a first surface of the imaging structure. The first location may be a first transverse offset distance from an axis of the imaging structure. An end of the second optical fiber may be at a second location of the first surface of the imaging structure. The second location may be a second transverse offset distance from the axis of the imaging structure. The method may include fusion splicing the end of the first optical fiber at the first location on the first surface of the imaging structure, and fusion splicing the end of the second optical fiber at the second location on the first surface of the imaging structure.