Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa.Math.ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.

Provided is a silica glass member for hermetic sealing of an ultraviolet SMD LED element to be suitably used for hermetic sealing of, and as a transmission window material for, a surface mount-type package (SMD) having an ultraviolet LED mounted thereon and configured to emit ultraviolet light in a wavelength range of from 200 nm to 350 nm. The silica glass member for hermetic sealing includes a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has: a first surface on an inside opposed to an SMD LED element; and a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and wherein the second surface on the outside corresponding to the first surface has formed therein a lens-like convex portion configured to process emitted light from the ultraviolet SMD LED element.

A quartz glass plate has a quartz glass plate body and a quartz glass member adhered to the quartz glass plate body through an adhesive layer, where the adhesive layer contains silica, and a sum of concentrations of Li, Na, and K ions, being alkali metal ions and Ca ions, being alkaline earth metal ions contained in the adhesive layer is 10 ppm by mass or less. Consequently, a step with a uniform thickness can be formed, and a quartz glass plate is not easily damaged by irradiation with a light containing an ultraviolet ray.

A body, such as a lamp body, includes a tubular element. At least one conductor is introduced into the tubular element and a glass material surrounds the conductor. The glass material forms a seal between the tubular element and the conductor. The glass material includes a sintered glass, such as a sintered glass ring, and may completely surround the conductor.

The present invention relates to a transparent sealing member. A quartz glass transparent sealing member is used in an optical component having at least one optical element, and a mounting board on which the optical element is mounted, and constitutes, with the mounting board, a package that houses the optical element. The concentration of aluminum in a surface portion is higher than the concentration of aluminum in an inner portion.

A low CTE boro-aluminosilicate glass having a low brittleness for use in wafer-level-packaging (WLP) applications is disclosed. The glass comprises a composition in mol-% of SiO.sub.2: 60-85, Al.sub.2O.sub.3: 1-17, B.sub.2O.sub.3: 8-20, Na.sub.2O: 0-5, K.sub.2O: 0-5, MgO: 0-10, CaO: 0-10, SrO: 0-10, and BaO: 0-10. An average number of non-bridging oxygen per polyhedron (NBO) is equal to or larger than 0.2 and a ratio B.sub.2O.sub.3/Al.sub.2O.sub.3 is equal to or larger than 0.5. The NBO is defined as NBO=2O.sub.mol/(Si.sub.mol+Al.sub.mol+B.sub.mol)4. A glass carrier wafer made from the low CTE boro-aluminosilicate glass and a use thereof as a glass carrier wafer for the processing of a silicon substrate are also disclosed, as well as a method for providing a low CTE boro-aluminosilicate glass.

An alkali-free glass has a strain point of 650 C. or more, an average coefficient of thermal expansion at 50 to 350 C. of from 3010.sup.7 to 4510.sup.7/ C., and a temperature T.sub.2 at which a glass viscosity reaches 10.sup.2 dPa.Math.s of from 1,500 to 1,800 C. The alkali-free glass contains, as represented by mol % based on oxides, SiO.sub.2: from 62 to 70%, Al.sub.2O.sub.3: from 9 to 16% B.sub.2O.sub.3: from 0 to 12%, MgO: from 3 to 10%, CaO: from 4 to 12%, SrO: from 0 to 6%, and Fe.sub.2O.sub.3: from 0.001 to 0.04%, provided that MgO+CaO+SrO+BaO is from 12 to 25%. The alkali-free glass has a -OH value of from 0.35 to 0.85/mm.

Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)average thermal expansion coefficient (ppm/ C.) at 50-350 C}300 (GPa.Math.ppm/ C.), wherein the relative dielectric constant at 20 C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20 C. and 35 GHz does not exceed 0.006.

Provided is a glass material that can satisfy both a high Faraday effect and a high light transmittance in a short wavelength range. A glass material contains, in % by mole, 30 to 50% Pr.sub.2O.sub.3 and 0.1 to 70% B.sub.2O.sub.3+P.sub.2O.sub.5.

The present disclosure relates to glass articles, a method of making the glass articles, and uses of the glass articles. The glass article has a UV-transmittance of more than 90% at 350 nm and at 500 nm and a total amount of Si.sub.2, B.sub.2O.sub.3 and Al.sub.2O.sub.3 of at least 75 mol %. The article is preferably used in the fields of biotechnology, MEMS, CIS, MEMS-like pressure sensor, display, micro array, electronic devices, microfluidics, semiconductor, high precision equipment, camera imaging, display technologies, sensor/semicon, electronic devices, home appliance, diagnostic product, and/or medical device.