The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Gradient refractive index (GRIN) materials can include multi-phase composites having substances with differing refractive indices disposed non-uniformly within one another. Particular glass composites having a gradient index of refraction can include: an amorphous phase, and a phase-separated region disposed non-uniformly within the amorphous phase. The glass composites include a mixture containing: GeZ.sub.2 and A.sub.2Z.sub.3 in a combined molar ratio of about 60% to about 95%, and CsX and PbZ in a combined molar ratio of about 5% to about 40%, where A is As, Sb or Ga, X is Cl, Br or I, and Z is S or Se. When A is As, the glass composites include PbZ in a molar ratio of about 15% or less. The amorphous phase and the phase-separated region have refractive indices that differ from one another. More particularly, A is Ga or As, X is Cl, and Z is Se.

The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

Latent colorant material compositions, soda-lime-silica glass compositions, and related methods of manufacturing color-strikable glass containers. The latent colorant material compositions may be introduced into a plurality of base glass compositions having redox numbers in the range of −40 to +20 to produce color-strikable glass compositions and color-strikable glass containers. The latent colorant material compositions introduced into the base glass compositions include a mixture of cuprous oxide (Cu.sub.2O), stannous oxide (SnO), bismuth oxide (Bi.sub.2O.sub.3), and carbon (C). After formation, the color-strikable glass containers may be heat-treated to strike red or black therein.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.

A marking composition for forming marks or indicia on a substrate is provided for laser marking applications. The composition includes a glass frit, a carrier, and absorber particles. The glass frit includes alkali metal oxides, glass forming oxides, and one or more transition metal oxides. The glass frit is devoid of at least one of bismuth and zinc.

Disclosed is an antenna on glass (AOG) device having an air cavity at least partially formed in a photosensitive glass substrate. An air cavity structure is at least partially encloses the air cavity and wherein the air cavity structure at least partially formed from the photosensitive glass substrate. An antenna is formed from portion of a top conductive layer disposed on a top surface of the air cavity structure and at least partially overlapping the air cavity. A metallization structure is provided having a bottom conductive layer disposed on a bottom surface of the air cavity structure, wherein the bottom conductive layer is electrically coupled to the top metal layer by a conductive pillar disposed through the photosensitive glass substrate. In addition, the AOG device may integrate one or more MIM capacitors and/or inductors that allow for RF filtering and impedance matching.