A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 μm and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.

A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 μm and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.

A glass powder is a glass powder comprising vanadium-tellurium-silver, which has a softening temperature of 230-330° C. and a median particle size of 1-2 μm; when the glass powder is applied to the silver paste, the requirement that the silver paste is sintered at the temperature of 230-400° C. can be met, and a firm three-dimensional network structure can be formed in the glass system after the silver paste is sintered, and the welding tension of a front silver electrode can be improved; the addition of other metal elements to the glass powder can enable the network structure of the glass powder to be more compact and complete and ensure the stability of the glass powder; the prepared silver paste can be sintered at a temperature of 230-400° C.

A glass powder is a glass powder comprising vanadium-tellurium-silver, which has a softening temperature of 230-330° C. and a median particle size of 1-2 μm; when the glass powder is applied to the silver paste, the requirement that the silver paste is sintered at the temperature of 230-400° C. can be met, and a firm three-dimensional network structure can be formed in the glass system after the silver paste is sintered, and the welding tension of a front silver electrode can be improved; the addition of other metal elements to the glass powder can enable the network structure of the glass powder to be more compact and complete and ensure the stability of the glass powder; the prepared silver paste can be sintered at a temperature of 230-400° C.

Provided is a sulfide solid electrolyte containing lithium, phosphorus, sulfur and chlorine, in which a molar ratio of the chlorine to the phosphorus, c (Cl/P), is greater than 1.0 and 1.9 or less, the sulfide solid electrolyte includes an argyrodite-type crystal structure, and a lattice constant of the argyrodite-type crystal structure is 9.820 Å or less.

The thick film resistor paste for a resistor has no abnormalities of cracks in appearance and sufficient surge resistance, especially for low resistance, while using lead borosilicate glass. The thick film resistor paste comprises a silver powder or a palladium powder, or a mixture of both of the silver powder and the palladium powder, a ruthenium-oxide-containing glass powder and an organic vehicle, the ruthenium-oxide-containing glass powder comprises 10 to 60 mass % of ruthenium oxide, a glass composition of the ruthenium-oxide-containing glass powder comprises 3 to 60 mass % of silicon oxide, 30 to 90 mass % of lead oxide, 5 to 50 mass % of boron oxide relative to 100 mass % of glass components, and, a combined amount of silicon oxide, lead oxide and boron oxide by mass % is 50 mass % or more relative to 100 mass % of the glass components.

The thick film resistor paste for a resistor has no abnormalities of cracks in appearance and sufficient surge resistance, especially for low resistance, while using lead borosilicate glass. The thick film resistor paste comprises a silver powder or a palladium powder, or a mixture of both of the silver powder and the palladium powder, a ruthenium-oxide-containing glass powder and an organic vehicle, the ruthenium-oxide-containing glass powder comprises 10 to 60 mass % of ruthenium oxide, a glass composition of the ruthenium-oxide-containing glass powder comprises 3 to 60 mass % of silicon oxide, 30 to 90 mass % of lead oxide, 5 to 50 mass % of boron oxide relative to 100 mass % of glass components, and, a combined amount of silicon oxide, lead oxide and boron oxide by mass % is 50 mass % or more relative to 100 mass % of the glass components.

Methods of synthesizing particles and the resulting particles are disclosed. The methods include synthesizing the particles in the presence of one or more additives. The resulting particles are smaller and easier to disperse in solution. Also described are methods of processing particles and the resulting particles. In particular embodiments, the particles are suited for incorporation into films.

Methods of synthesizing particles and the resulting particles are disclosed. The methods include synthesizing the particles in the presence of one or more additives. The resulting particles are smaller and easier to disperse in solution. Also described are methods of processing particles and the resulting particles. In particular embodiments, the particles are suited for incorporation into films.

A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.