C03C8/02

PASTES FOR PRINTING THREE-DIMENSIONAL OBJECTS IN ADDITIVE MANUFACTURING PROCESSES
20170246686 · 2017-08-31 ·

A composition for the additive manufacture of three-dimensional objects is provided. The composition includes a sinterable frit, a protein binder, and an aqueous-based solvent.

METHODS FOR STRENGTHENING THE EDGE OF LAMINATED GLASS ARTICLES AND LAMINATED GLASS ARTICLES FORMED THEREFROM
20170246841 · 2017-08-31 · ·

A method for strengthening an edge of a glass laminate including a glass core layer positioned between a first glass clad layer and a second glass clad layer may include forming a channel in the edge of the glass laminate. Sidewalls of the channel may be formed from the first glass clad layer and the second glass clad layer. Glass filler material having a filler coefficient of thermal expansion greater than a core coefficient of thermal expansion may be positioned in the channel. The glass filler material and the sidewalls of the channel may be fused to the second glass clad layer thereby forming an edge cap over the channel. The edge of the glass laminate is under compressive stress after the glass filler material is enclosed in the channel.

METHODS FOR STRENGTHENING THE EDGE OF LAMINATED GLASS ARTICLES AND LAMINATED GLASS ARTICLES FORMED THEREFROM
20170246841 · 2017-08-31 · ·

A method for strengthening an edge of a glass laminate including a glass core layer positioned between a first glass clad layer and a second glass clad layer may include forming a channel in the edge of the glass laminate. Sidewalls of the channel may be formed from the first glass clad layer and the second glass clad layer. Glass filler material having a filler coefficient of thermal expansion greater than a core coefficient of thermal expansion may be positioned in the channel. The glass filler material and the sidewalls of the channel may be fused to the second glass clad layer thereby forming an edge cap over the channel. The edge of the glass laminate is under compressive stress after the glass filler material is enclosed in the channel.

Composition for forming solar cell electrode and electrode produced from same

A composition for solar cell electrodes and electrodes fabricated using the same. The composition includes a silver (Ag) powder; a first glass frit containing PbO and a second glass frit containing V.sub.2O.sub.5 and TeO.sub.2; and an organic vehicle. The composition includes two types of glass frits on PbO and V.sub.2O.sub.5-TeO.sub.2, respectively, thereby minimizing contact resistance and adverse influence on a p-n junction of silicon solar cells.

Composition for forming solar cell electrode and electrode produced from same

A composition for solar cell electrodes and electrodes fabricated using the same. The composition includes a silver (Ag) powder; a first glass frit containing PbO and a second glass frit containing V.sub.2O.sub.5 and TeO.sub.2; and an organic vehicle. The composition includes two types of glass frits on PbO and V.sub.2O.sub.5-TeO.sub.2, respectively, thereby minimizing contact resistance and adverse influence on a p-n junction of silicon solar cells.

Tellurate Joining Glass Having Processing Temperatures Less Than Or Equal To 420°C
20170243995 · 2017-08-24 ·

The present invention relates to a glass, in particular a glass for the joining of glass panes for the production of vacuum insulating glasses at processing temperatures ≦420° C., to the corresponding composite glass, and to the corresponding glass paste. Moreover, the present invention relates to a vacuum insulating glass produced using the glass paste according to the invention, to the production process thereof, and to the use of the inventive glass and/or composite glass, and glass paste. The glass according to the invention is characterized in that it comprises the following components, in units of mol-%: V.sub.2O.sub.5 5-58 mol-%,Te0.sub.2 40-90 mol-%, and at least one oxide selected from ZnO 38-52 mol-%, or Al.sub.2O.sub.3 1-25 mol %, or MoO.sub.3 1-10 mol-%, or WO.sub.3 1-10 mol-%, or a combination thereof.

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD OF PRODUCING MULTILAYER ELECTRONIC COMPONENT USING THE SAME, AND MULTILAYER ELECTRONIC COMPONENT
20170236611 · 2017-08-17 ·

A photosensitive conductive paste that contains(a) a conductive powder in an amount of 70.3 to 85.6 mass % with respect to the total amount of the photosensitive conductive paste; (b) a photosensitive resin composition containing an alkali-soluble polymer, a photosensitive monomer, a pnotopolym.erization initiator, and a solvent; and (c) a glass frit. The mass ratio of the glass frit to the conductive powder is 0.020 to 0.054, and the glass frit has a softening point that is equal to or above the temperature at which sintering of the conductive powder starts.

Composition for forming solar cell electrode and electrode prepared using the same

Example embodiments relate to a composition for forming a solar cell electrode, and a solar cell electrode prepared using the composition. The composition for forming a solar cell electrode includes a silver (Ag) powder, a glass frit, and an organic vehicle, wherein the glass frit includes silver (Ag); tellurium (Te); and at least one selected from the group of lithium (Li), sodium (Na), and potassium (K), a molar ratio of the silver (Ag):the tellurium (Te) included in the glass frit is in a range of about 1:0.1 to about 1:50, and a molar ratio of the silver (Ag):lithium (Li), sodium (Na) or potassium (K) is in a range of about 1:0.01 to about 1:10. The solar cell electrode prepared using the composition has excellent fill factor and conversion efficiency due to minimized contact resistance (Rc) and series resistance (Rs).