The present invention relates a molded composite material and a method and process for creating the composite material from either recycled low grade mixed glass cullet or new glass. The composite material including; crushed glass; one or more aluminium compounds selected from oxide and hydrate at combined 0.40%-0.78% weight per weight of the glass; oxides of silicon, boron, sodium, calcium and potassium at combined 1.27%-1.90% weight per weight of the glass; zirconium silicate at 0.48%-1.3% weight per weight of the glass; and optionally tin oxide at 0%-0.45% weight per weight of the glass. The composite of the present invention can be used for making tiles, bench tops, work surfaces or other similar types of building products. The use of low grade mixed glass can also help reduce the amount of used glass being dumped in landfill or used in other low value enterprises such as providing highway aggregate or landfill cover.

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

A process for producing a glazed ceramic body, in which a glazing material is applied to a non-densely sintered substrate material and the substrate material and the glazing material are subjected to a heat treatment in order to obtain the glazed body.

A process for producing a glazed ceramic body, in which a glazing material is applied to a non-densely sintered substrate material and the substrate material and the glazing material are subjected to a heat treatment in order to obtain the glazed body.

Disclosed herein are embodiments of a borosilicate glass composition having a unique fracture behavior. The borosilicate glass composition may be incorporated into a glass laminate including a first glass ply and a second glass ply. The second glass ply may comprise the borosilicate glass composition. The second glass ply may have a coefficient of thermal expansion of less than or equal to 5.1 ppm°/C. A combined thickness of the first glass ply and the second glass ply may be greater than or equal to 3.7 mm and less than or equal to 6.0 mm, and a ratio of the second thickness to the combined thickness is greater than or equal to 0.825. The second glass ply does not fail when the first major surface is impacted by a Vickers diamond impactor at an impact energy of 0.25 Joules.

Enamel composition, in particular intended for covering a glass pane of a fireplace insert, comprising at least one glass frit, at least one pigment in a content varying from 40 to 65% of the total weight of the enamel, preferably from 45 to 60%, and optionally at least one vehicle or medium, characterized in that the glass frit comprises the following constituents, within the limits defined below, limits included, expressed as percentages by weight of the total weight of the frit: TABLE-US-00001 SiO.sub.2 45-65%  Al.sub.2O.sub.3 0-13% B.sub.2O.sub.3 23-55%  Na.sub.2O 0-10% K.sub.2O 0-10% Li.sub.2O  0-10%.

Enamel composition, in particular intended for covering a glass pane of a fireplace insert, comprising at least one glass frit, at least one pigment in a content varying from 40 to 65% of the total weight of the enamel, preferably from 45 to 60%, and optionally at least one vehicle or medium, characterized in that the glass frit comprises the following constituents, within the limits defined below, limits included, expressed as percentages by weight of the total weight of the frit: TABLE-US-00001 SiO.sub.2 45-65%  Al.sub.2O.sub.3 0-13% B.sub.2O.sub.3 23-55%  Na.sub.2O 0-10% K.sub.2O 0-10% Li.sub.2O  0-10%.

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.