Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

A composite ceramic atomizer includes a first main body and a second main body that are integrally formed by using a glazing and sealing process, and the first main body is connected to the second main body through a glazed surface formed by glazing. The glazed surface completely or partially covers a surface at the joint between the first main body and the second main body. The first main body includes a heating carrier and a conductive path for heating, where the conductive path is formed on a surface of or inside the heating carrier and has a first contact part and a second contact part connected to a power supply. The second main body is used for liquid conduction. Further provided is a method for preparing the composite ceramic atomizer.

A composite ceramic atomizer includes a first main body and a second main body that are integrally formed by using a glazing and sealing process, and the first main body is connected to the second main body through a glazed surface formed by glazing. The glazed surface completely or partially covers a surface at the joint between the first main body and the second main body. The first main body includes a heating carrier and a conductive path for heating, where the conductive path is formed on a surface of or inside the heating carrier and has a first contact part and a second contact part connected to a power supply. The second main body is used for liquid conduction. Further provided is a method for preparing the composite ceramic atomizer.

A ground coat enamel composition for production of an adhesion promoter layer between steel and at least one cover coat enamel for production of an enamel-based coating that is highly corrosion-resistant with respect to mechanical, thermal and chemical effects. The ground coat enamel composition includes boron oxide (B.sub.2O.sub.3) and alkali metal oxide(s), especially Li.sub.2O, Na.sub.2O and/or K.sub.2O, in percentage proportions by weight: a first main constituent, SiO.sub.2 from 35-70%, preferably 40-65%, and, as a second main constituent, from Fe.sub.2O.sub.3 5-28%, preferably in the range from 7-23% and particularly 8%-15% by weight. Also disclosed is a ground coat enamel layer produced from such a ground coat enamel composition. A highly corrosion-resistant article having such a ground coat enamel layer. A method for producing such a ground coat enamel layer and also a method for producing a highly corrosion-resistant article using such a ground coat enamel composition.

A display panel may include a first display substrate, a second display substrate disposed over the first display substrate, and a sealing member bonding the first display substrate and the second display substrate. The sealing member may include a frit sealing member including an outer region and an inner region, with the inner region disposed next to an inner side of the outer region and having a first crystallization temperature lower than a second crystallization temperature of the outer region, and an organic sealing member disposed next to an inner side of the frit sealing member.

The present invention provides a glass for semiconductor element coating including as a glass composition, in terms of mol %, 55% to 85% of SiO.sub.2, 12% to 40% of PbO, 0.1% to 10% of Al.sub.2O.sub.3, and 0.1% to 6% of GeO.sub.2+Ta.sub.2O.sub.5+Nb.sub.2O.sub.5+Bi.sub.2O.sub.3.

The present invention provides a glass for semiconductor element coating including as a glass composition, in terms of mol %, 55% to 85% of SiO.sub.2, 12% to 40% of PbO, 0.1% to 10% of Al.sub.2O.sub.3, and 0.1% to 6% of GeO.sub.2+Ta.sub.2O.sub.5+Nb.sub.2O.sub.5+Bi.sub.2O.sub.3.

A particle mixture comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises ≥10 to ≤25 mol. % BaO; and ≥0 to ≤10 mol. % Bi.sub.2O.sub.3; and wherein the second glass frit comprises: ≥35 to ≤55 mol. % Bi.sub.2O.sub.3; ≥2 to ≤20 mol. % ZnO; and ≥10 to ≤40 mol. % B.sub.2O.sub.3.

A glass composition with high Young's modulus and specific modulus, wherein the glass composition includes the following components by weight percentage: 30-46% of SiO.sub.2, 0-6% of B.sub.2O.sub.3, 10-30% of Al.sub.2O.sub.3, 4-20% of CaO, 2-15% of MgO, and 13-32% of Y.sub.2O.sub.3. The glass composition uses common chemical raw materials. By reasonably arranging the contents of each component, the glass is good in heat resistance, chemical stability and press-molding devitrification resistance performance, low in high-temperature viscosity, convenient in bubble elimination, with specific modulus above 34 and Young's modulus above 100 GPa, and is suitable for hard disk substrate manufacturing, semiconductor sealing and other fields.