A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Disclosed is a sealing glass composition substantially not containing B.sub.2O.sub.3 or Al.sub.2O.sub.3, which is a high-strength, high-expansive crystallizing glass composition that can be used at high temperatures of not less than 950° C. The composition substantially not containing boron oxide, alkali metal oxides or aluminum oxide, but containing, in mol %, SiO.sub.2: 40-55, BaO: 18-35, TiO.sub.2+ZrO.sub.2: 0.1-10, ZnO: 0-15, CaO: 0-20, MgO: 0-9, SrO: 0-5, and La.sub.2O.sub.3: 0-2, wherein the total content of RO (R: Mg, Ca, Sr, Ba and Zn) is at least 44 mol %, and wherein the glass composition, when fired in the form of glass powder at a temperature of 850-1050° C, turns into a crystallized glass that exhibits a thermal expansion coefficient of 90-150×10.sup.−7/° C. in the range of 50-850° C.

Disclosed is a sealing glass composition substantially not containing B.sub.2O.sub.3 or Al.sub.2O.sub.3, which is a high-strength, high-expansive crystallizing glass composition that can be used at high temperatures of not less than 950° C. The composition substantially not containing boron oxide, alkali metal oxides or aluminum oxide, but containing, in mol %, SiO.sub.2: 40-55, BaO: 18-35, TiO.sub.2+ZrO.sub.2: 0.1-10, ZnO: 0-15, CaO: 0-20, MgO: 0-9, SrO: 0-5, and La.sub.2O.sub.3: 0-2, wherein the total content of RO (R: Mg, Ca, Sr, Ba and Zn) is at least 44 mol %, and wherein the glass composition, when fired in the form of glass powder at a temperature of 850-1050° C, turns into a crystallized glass that exhibits a thermal expansion coefficient of 90-150×10.sup.−7/° C. in the range of 50-850° C.

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

A method for producing a shaped glass article may include heating at least a portion of a mold-facing surface of the glass article to a forming temperature, shaping the glass article in a mold, and removing the multilayer coating from the glass article. The glass article may be coated with a multi-layer removable coating including an inner layer in contact with the glass article and an outer layer disposed over the inner layer. The mold may be in direct contact with the outer layer during shaping. The inner layer may include a first glass having a softening point of at least about 50° C. less than a softening point of the glass article. The outer layer may include a second glass having a softening point of at least about 50° C. greater than the softening point of the glass article.

A method for producing a shaped glass article may include heating at least a portion of a mold-facing surface of the glass article to a forming temperature, shaping the glass article in a mold, and removing the multilayer coating from the glass article. The glass article may be coated with a multi-layer removable coating including an inner layer in contact with the glass article and an outer layer disposed over the inner layer. The mold may be in direct contact with the outer layer during shaping. The inner layer may include a first glass having a softening point of at least about 50° C. less than a softening point of the glass article. The outer layer may include a second glass having a softening point of at least about 50° C. greater than the softening point of the glass article.

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.