Patent classifications
C03C8/24
SILICATE GLASS, METHOD FOR PREPARING SILICATE GLASS-CERAMICS BY USING THE SILICATE GLASS, AND METHOD FOR PREPARING NANO LITHIUM DISILICATE GLASS-CERAMICS BY USING THE SILICATE GLASS
Provided is a silicate glass, a method for preparing a silicate glass-ceramics by using the silicate glass, and a method for preparing a lithium disilicate glass-ceramics by using the silicate glass, and more particularly, to a method for preparing a glass-ceramics that has a nanosize of 0.2 to 0.5 μm and contains lithium disilicate and silicate crystalline phases. A nano lithium disilicate glass-ceramics containing a SiO.sub.2 crystalline phase includes: a glass composition including 70 to 85 wt % SiO.sub.2, 10 to 13 wt % Li.sub.2O, 3 to 7 wt % P.sub.2O.sub.5 working as a nuclei formation agent, 0 to 5 wt % Al.sub.2O.sub.3 for increasing a glass transition temperature and a softening point and enhancing chemical durability of glass, 0 to 2 wt % ZrO.sub.2, 0.5 to 3 wt % CaO for increasing a thermal expansion coefficient of the glass, 0.5 to 3 wt % Na.sub.2O, 0.5 to 3 wt % K.sub.2O, and 1 to 2 wt % colorants, and 0 to 2.0 wt % mixture of MgO, ZnO, F, and La.sub.2O.sub.3.
Vanadium-based frit materials, and/or methods of making the same
Certain example embodiments relate to improved seals for glass articles. Certain example embodiments relate to a composition used for sealing an insulted glass unit. In certain example embodiments the composition includes vanadium oxide, barium oxide, zinc oxide, and at least one additional additive. For instance, another additive that is a different metal oxide or different metal chloride may be provided. In certain example embodiments, a vacuum insulated glass unit includes first and second glass substrates that are sealed together with a seal that includes the above-described composition.
Vanadium-based frit materials, and/or methods of making the same
Certain example embodiments relate to improved seals for glass articles. Certain example embodiments relate to a composition used for sealing an insulted glass unit. In certain example embodiments the composition includes vanadium oxide, barium oxide, zinc oxide, and at least one additional additive. For instance, another additive that is a different metal oxide or different metal chloride may be provided. In certain example embodiments, a vacuum insulated glass unit includes first and second glass substrates that are sealed together with a seal that includes the above-described composition.
Method for assembling parts made of SiC materials by means of non-reactive brazing in an oxidizing atmosphere, brazing compositions, and gasket and assembly obtained by said method
A method is described for assembling at least two parts made of silicon carbide based materials by non-reactive brazing in an oxidizing atmosphere, each of the parts comprising a surface to be assembled, wherein the parts are placed in contact with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient for completely or at least partially melting the brazing composition, or rendering the brazing composition viscous, and the parts and the brazing composition are cooled so as to form, after cooling the latter to ambient temperature, a moderately refractory joint. The non-reactive brazing composition is a composition A consisting of silica (SiO.sub.2), alumina (Al.sub.2O.sub.3), and calcium oxide (CaO), or a composition B consisting of alumina (Al.sub.2O.sub.3), calcium oxide (CaO), and magnesium oxide (MgO), and, before heating the assembly formed by the parts and the brazing composition to the brazing temperature, a supply of silicon in a non-oxidized form is carried out on the surfaces to be assembled of the parts to be assembled, and/or on the surface layers comprising the surfaces to be assembled of the parts to be assembled, and/or in the brazing composition.
Method for assembling parts made of SiC materials by means of non-reactive brazing in an oxidizing atmosphere, brazing compositions, and gasket and assembly obtained by said method
A method is described for assembling at least two parts made of silicon carbide based materials by non-reactive brazing in an oxidizing atmosphere, each of the parts comprising a surface to be assembled, wherein the parts are placed in contact with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient for completely or at least partially melting the brazing composition, or rendering the brazing composition viscous, and the parts and the brazing composition are cooled so as to form, after cooling the latter to ambient temperature, a moderately refractory joint. The non-reactive brazing composition is a composition A consisting of silica (SiO.sub.2), alumina (Al.sub.2O.sub.3), and calcium oxide (CaO), or a composition B consisting of alumina (Al.sub.2O.sub.3), calcium oxide (CaO), and magnesium oxide (MgO), and, before heating the assembly formed by the parts and the brazing composition to the brazing temperature, a supply of silicon in a non-oxidized form is carried out on the surfaces to be assembled of the parts to be assembled, and/or on the surface layers comprising the surfaces to be assembled of the parts to be assembled, and/or in the brazing composition.
Tellurate Joining Glass Having Processing Temperatures Less Than Or Equal To 420°C
The present invention relates to a glass, in particular a glass for the joining of glass panes for the production of vacuum insulating glasses at processing temperatures ≦420° C., to the corresponding composite glass, and to the corresponding glass paste. Moreover, the present invention relates to a vacuum insulating glass produced using the glass paste according to the invention, to the production process thereof, and to the use of the inventive glass and/or composite glass, and glass paste. The glass according to the invention is characterized in that it comprises the following components, in units of mol-%: V.sub.2O.sub.5 5-58 mol-%,Te0.sub.2 40-90 mol-%, and at least one oxide selected from ZnO 38-52 mol-%, or Al.sub.2O.sub.3 1-25 mol %, or MoO.sub.3 1-10 mol-%, or WO.sub.3 1-10 mol-%, or a combination thereof.
Tellurate Joining Glass Having Processing Temperatures Less Than Or Equal To 420°C
The present invention relates to a glass, in particular a glass for the joining of glass panes for the production of vacuum insulating glasses at processing temperatures ≦420° C., to the corresponding composite glass, and to the corresponding glass paste. Moreover, the present invention relates to a vacuum insulating glass produced using the glass paste according to the invention, to the production process thereof, and to the use of the inventive glass and/or composite glass, and glass paste. The glass according to the invention is characterized in that it comprises the following components, in units of mol-%: V.sub.2O.sub.5 5-58 mol-%,Te0.sub.2 40-90 mol-%, and at least one oxide selected from ZnO 38-52 mol-%, or Al.sub.2O.sub.3 1-25 mol %, or MoO.sub.3 1-10 mol-%, or WO.sub.3 1-10 mol-%, or a combination thereof.
Sealed devices comprising transparent laser weld regions
Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.
Sealed devices comprising transparent laser weld regions
Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.