Patent classifications
C03C17/06
Thin glass elongated body
There is provided a thin glass elongated body that can be prevented from being broken when subjected to processing or treatment by a roll-to-roll process. A thin glass elongated body of the present invention includes: a main body that includes an elongated thin glass; and a handling section that includes tough films connected to both ends of the main body in a length direction of the main body.
LASER WELDED GLASS PACKAGES AND METHODS OF MAKING
A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.
Gyroscope And Fabrication Process
Gyroscopes are sensors that measure angular rate and angular orientation. A three-dimensional fused silica micro shell rate-integrating gyroscope is presented. One aspect of the gyroscope includes the use of optical sensors to detect motion of the resonator. The proposed gyroscope is attractive because it achieves several magnitudes higher accuracy as well as high vibration and shock insensitivity from a novel resonator design as well as other unique manufacturing processes.
Hermetic metallized via with improved reliability
According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.
Hermetic metallized via with improved reliability
According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.
Process for preparing a dichromatic material in the form of a film
The invention relates to a process for preparing a dichromatic material, in the form of a translucent film, comprising monodisperse nanoparticles formed of gold and optionally of a noble metal chosen from platinum, palladium, silver and copper, and at least one organic macromolecule chosen from proteins, polysaccharides and synthetic polymers; said dichromatic material; and the uses thereof.
Process for preparing a dichromatic material in the form of a film
The invention relates to a process for preparing a dichromatic material, in the form of a translucent film, comprising monodisperse nanoparticles formed of gold and optionally of a noble metal chosen from platinum, palladium, silver and copper, and at least one organic macromolecule chosen from proteins, polysaccharides and synthetic polymers; said dichromatic material; and the uses thereof.
A MICROWAVE TRANSFORMER AND A SYSTEM FOR FABRICATING THE SAME
A conductive layer includes a microwave transformer for scaling the intensity of a microwave signal of a first frequency by a scaling factor. The transformer includes a first physical area delimited with a closed curve on the conductive layer for receiving the microwave signal from a first space angle and re-emitting a ray of the microwave signal to a second space angle. A ratio of the first physical area to the second physical area is smaller than 0.5. The ratio of the first effective area to the first physical area is larger than the ratio of the second effective area to the second physical area. The scaling factor is the ratio of the maximal intensity of the re-emitted ray and the intensity of a ray through an open aperture having a physical area equivalent to the second physical area in the same direction than the re-emitted ray.
Coupled transmission line resonate RF filter
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
ASYMMETRICAL VACUUM-INSULATED GLAZING UNIT
A vacuum insulating glazing unit with an infrared reflecting coating, having a first glass pane with a thickness Z.sub.1, bearing the infrared reflecting coating on the inner pane face, and an energetical absorptance EA.sub.1; a second glass pane with a thickness Z.sub.2 and an energetical absorptance EA.sub.2; a set of discrete spacers between the first and second glass panes maintaining a distance between the two glass panes and forming an array with a pitch λ; a hermetically bonding seal, sealing the distance between the two glass panes over a perimeter thereof; an internal volume, V, defined by the two glass panes, spacers and closed by the hermetically bonding seal; where Z.sub.1>Z.sub.2 and ΔEA≤0.0033 ΔZ.sup.2/mm.sup.2−0.0468 ΔZ/mm+0.7702; where ΔEA=EA.sub.1−2EA.sub.2, and Z.sub.1≥5 mm, Z.sub.2≥3 mm, ΔZ=Z.sub.1−Z.sub.2≥1 mm, and 10 mm≤λ≤35 mm.