Disclosed is a low-E glass annealing apparatus. This apparatus includes a transfer device for transferring a glass substrate on which a coating film is formed; a laser module installed at a position on a path of the transfer device and formed to stably form a coating film by radiating a laser beam on the glass substrate at a predetermined angle; and a pair of reflective mirrors installed at top and bottom positions of the glass substrate to face reflective surfaces each other, in front of a point where the glass substrate contacts with the laser beam in a laser beam radiating direction, so that reflected light or transmitted light of the laser beam may be reflected. According to the present invention, damages generated by thermal shock can be suppressed and energy efficiency can be enhanced although a low-E coating film is manufactured by heating a glass substrate using a laser module.

Devices, apparatuses, and methods are disclosed that include a glass or glass ceramic substrate with a bleached region and an unbleached region. Examples include a substrate with a region that transmits IR wavelength light, and a region that is substantially opaque to IR light. Examples include additional opacity in some or all regions to visible wavelength light and/or UV wavelength light.

A glass-based article may include from about 45 mol. % to about 80 mol. % SiO.sub.2; from about 0 mol. % to about 10 mol. % Na.sub.2O; less than about 5 mol. % K.sub.2O; a non-zero amount of Al.sub.2O; and an amorphous phase and a crystalline phase. The article may further in include a stress profile comprising a surface compressive stress (CS) and a maximum central tension (CT). A ratio of Li.sub.2O (mol. %) to R.sub.2O (mol. %) in the article is from about 0.5 to about 1, where R.sub.2O is the sum of Li.sub.2O, Na.sub.2O, and K.sub.2O in the article. CT may be greater than or equal to about 50 MPa and less than about 100 MPa. CS may be greater than 2.0.Math.CT. A depth of compression (DOC) of the stress profile may be greater than or equal to 0.14.Math.t and less than or equal to 0.25.Math.t, where t is the thickness of the article.

A method of forming a graphene device includes: providing a glass substrate with a blocking layer disposed thereon to form a stack; providing a first electrode and a second electrode; increasing the temperature of the stack to at least 100° C.; applying an external electric field (V.sub.P) to the first electrode such that at least one metal ion of the glass substrate migrates toward the first electrode to create a depletion region in the glass substrate adjacent the second electrode; decreasing the temperature of the stack to room temperature while applying the external electric field to the first electrode; and after reaching room temperature, setting the external electric field to zero to create a frozen voltage region adjacent the second electrode.

A strengthened cover glass or glass-ceramic sheet or article as well as processes and systems for making the strengthened glass or glass-ceramic sheet or article is provided for use in consumer electronic devices. The process comprises cooling the cover glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened cover glass sheets for use in or on consumer electronic products.

One aspect is a process to producing a synthetic quartz glass, including an annealing treatment that includes: putting a synthetic quartz glass as a parent material into a heat treatment furnace; elevating a temperature in the heat treatment furnace to a prescribed keeping temperature that is equal to or higher than the annealing point; keeping the keeping temperature; annealing the synthetic quartz glass; and taking the synthetic quartz glass out of the heat treatment furnace. The process includes determining an annealing rate v [° C./h] of the annealing step based on a value of S/V [mm.sup.2/mm.sup.3], wherein S [mm.sup.2] is the surface area of the synthetic quartz glass as a parent material and V [mm.sup.3] is the volume thereof and a target birefringence Re [nm/cm] for the synthetic quartz glass after the annealing, and the annealing step is performed at the determined annealing rate v.

There is provided a means which carries out a fire-blast treating effectively upon removing a deteriorated region caused by processing in a process of producing a glass vessel. In a process of producing a glass vessel by fire-blast treating an internal surface 10 of a preform of the glass vessel with a flame from a burner 30 so as to produce the glass vessel, said fire-blast treating is carried out such that a temperature of an outer surface portion of the preform which portion is opposed to the deteriorated region caused by processing is between 650° C. and 800° C. when the flame is scanned along the internal surface of the preform toward an opening of the preform.

Vitreous material treatment uses a piece of vitreous material having two opposite faces and a laser emission beam source. The vitreous material is heated, and a laser beam radiated on one of the faces of the vitreous material to scan following a line surpassing the opposite edges of the face of the vitreous material while the vitreous material oscillates along a path. The scan is performed while the vitreous material is heated. The vitreous material is cooled. The laser beam scan follows a line surpassing the opposite edges of the face. The scan performed oscillating between a first point and a second point.

A glass substrate and a method for manufacturing the glass substrate are provided. The glass substrate may include a base glass including SiO.sub.2, Al.sub.2O.sub.3, and Li.sub.2O, and nanocrystals having an average diameter in a range from about 5 nm to about 10 nm, thereby exhibiting enhanced surface strength properties while maintaining good transmittance properties. The method may include a step of heat-treating a base glass, thereby providing a glass substrate having enhanced strength properties.

A borosilicate glass includes, in terms of molar percentage based on oxides: 70.0%≤SiO.sub.2≤85.0%; 5.0%≤B.sub.2O.sub.3≤20.0%; 0.0%≤Al.sub.2O.sub.3≤3.0%; 0.0%≤Li.sub.2O≤5.0%; 0.0%≤Na.sub.2O≤5.0%; 0.0%≤K.sub.2O≤5.0%; 0.0%≤MgO≤5.0%; 0.0%≤CaO≤5.0%; 0.0%≤SrO≤5.0%; 0.0%≤BaO≤5.0%; and 0.06%≤Fe.sub.2O.sub.3≤1.0%, in which the borosilicate glass has a basicity of 0.485 or more, and [AlO.sub.3]/([SiO.sub.2]+[B.sub.2O.sub.3]) of 0.015 or less.