Patent classifications
C03C27/02
OPTICAL WINDOW WITH EMBEDDED SCREEN
A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.
METHOD FOR PRODUCING A SENSOR ELEMENT FOR A POTENTIOMETRIC SENSOR, AND SENSOR ELEMENT
The invention relates to a method for producing a sensor element for a potentiometric sensor, comprising: conditioning at least one region of a substrate, which consists of copper or a copper-based alloy having a mass fraction of at least 60% of copper, for producing an oxide layer comprising monovalent copper (Cu(I)), and applying an ion-selective, in particular a pH-selective enamel layer at least onto the region of the substrate.
Glass tube for metal sealing and glass for metal sealing
A glass tube for sealing a metal includes a glass that contains, in terms of mass %, 50% or more of SiO.sub.2+B.sub.2O.sub.3, 0% to 10% of Al.sub.2O.sub.3, 3% to 20% of RO (R is an alkaline earth metal), and 11% to 22% of R′.sub.2O (R′ is an alkali metal), and that has 10 μl/g or less of an amount of CO.sub.2 emitted when heated from a room temperature to 1100° C.
Glass tube for metal sealing and glass for metal sealing
A glass tube for sealing a metal includes a glass that contains, in terms of mass %, 50% or more of SiO.sub.2+B.sub.2O.sub.3, 0% to 10% of Al.sub.2O.sub.3, 3% to 20% of RO (R is an alkaline earth metal), and 11% to 22% of R′.sub.2O (R′ is an alkali metal), and that has 10 μl/g or less of an amount of CO.sub.2 emitted when heated from a room temperature to 1100° C.
Lead insertion system
A lead insertion system adapted to insert a lead into a glass tube includes a first robot on which a first gripper is mounted and a second robot on which a second gripper is mounted. The first gripper grips the glass tube and the second gripper grips the lead. The lead insertion system includes a flame heater heating the glass tube gripped by the first robot and the lead gripped by the second robot with a flame. The second robot inserts the lead into the glass tube held by the first robot with the lead heated by the flame and the glass tube heated and softened by the flame.
Wired and Detachable Charging-Unit of Electric Product
A wired and detachable, moveable, dis-assemble, re-assemble USB or Wireless charging-unit(s) which has minimum feet DC power delivery wire that is manual to coil, wrap within unit's own space for wire-arrangement, said each wired and detachable unit(s) cover broad area and people can chare external product(s) at any location within said area; wherein said unit(s) assembly with electric product which is at least one (1) desk, floor, wall-mounted item, light, (2) power strip, (3) selfie LED light has built-in or added-on image capture device(s).
Wired and Detachable Charging-Unit of Electric Product
A wired and detachable, moveable, dis-assemble, re-assemble USB or Wireless charging-unit(s) which has minimum feet DC power delivery wire that is manual to coil, wrap within unit's own space for wire-arrangement, said each wired and detachable unit(s) cover broad area and people can chare external product(s) at any location within said area; wherein said unit(s) assembly with electric product which is at least one (1) desk, floor, wall-mounted item, light, (2) power strip, (3) selfie LED light has built-in or added-on image capture device(s).
JOIN HAVING INSULATING COMPONENT WITH PARTIALLY CRYSTALLIZED GLASS
A join is provided that includes a first joining partner, a second joining partner having a surface, an electrically insulating component connecting the first joining partner in the second joining partner so that the first joining partner is electrically insulated from the second joining partner and so that the first joining partner extends from the surface. The electrically insulating component has a structure between the first and second joining partners that elongates from the surface along the first joining partner. The electrically insulating component and/or the structure is an at least partially crystallized glass.
Hermetic Electrical Feedthrough Comprising a Pt-Ni-based Pin Alloy
A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.
Hermetic Electrical Feedthrough Comprising a Pt-Ni-based Pin Alloy
A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.