The present invention relates to a process for the manufacture of a glass container that comprises the steps of: a) providing a first glass element; b) providing a second element made of a material selected from: glass, ceramic, metal and metallic alloy; said first element and said second element, joined together, defining a containment cavity of said glass container; c) depositing a sealing composition comprising at least one glass frit dispersed in at least one dispersing liquid on at least one surface of at least one of said first element and said second element; d) positioning said first element and said second element in contact with each other so that said sealing composition is arranged between said first element and said second element; e) heating said sealing composition so as to melt said glass frit and form a sealing layer between said first element and said second element. The present invention further relates to a glass container, such as, for example, a bottle, a cup or a jar, and related uses.

In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO.sub.x) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

Methods are provided for forming high temperature coating over ceramic components, such as ceramic turbomachine components. In various embodiments, the method includes the step or process of at least partially filling a reactor vessel with a reaction solution containing a solution-borne rare earth cation source. A silicon-containing surface region of a ceramic component is submerged in the reaction solution, and a solvothermal growth process is carried-out. During the solvothermal growth process, the reaction solution is subject to elevated temperature and pressure conditions within the reactor vessel in the presence of a silicate anion source, which reacts with the solution-borne rare earth cation source to grow a rare earth silicate layer over the silicon-containing surface region of the ceramic component.

Rear quarter glass has a glass plate, a plastic molding, and a metal molding. A retainer is arranged between the plastic molding and the metal molding. The retainer has a first through-hole and a pin portion. The metal molding has a projecting portion that is inserted through the first through-hole. The projecting portion has an end section that projects from the first through-hole in a state inserted through the first through-hole. The plastic molding has a second through-hole through which the pin portion is inserted. The pin portion has an end section that projects from the second through-hole in a state inserted through the second through-hole. The end section of the projecting portion is swaged to the retainer by swaging through thermal deformation. The end section of the pin portion is swaged to the plastic molding by swaging through thermal deformation.

Rear quarter glass has a glass plate, a plastic molding, and a metal molding. A retainer is arranged between the plastic molding and the metal molding. The retainer has a first through-hole and a pin portion. The metal molding has a projecting portion that is inserted through the first through-hole. The projecting portion has an end section that projects from the first through-hole in a state inserted through the first through-hole. The plastic molding has a second through-hole through which the pin portion is inserted. The pin portion has an end section that projects from the second through-hole in a state inserted through the second through-hole. The end section of the projecting portion is swaged to the retainer by swaging through thermal deformation. The end section of the pin portion is swaged to the plastic molding by swaging through thermal deformation.

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which .sub.HAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein .sub.HAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its .sub.interface laser weld>.sub.HAZ, wherein .sub.interface laser weld is peak value of compressive stress in the laser welded zone.

A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.