A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

A machine arrangement, including at least one bearing ring, wherein a glass fiber is connected with the machine arrangement. To allow a proper measurement of stresses, even at curved surfaces of the machine arrangement as it is typical in the case of bearing rings, the connection between the glass fiber and the machine arrangement is established by a glass material. The glass material is connected by material bonding with the machine arrangement as well as with the glass fiber.

Contact pins for glass seals is provided having an iron alloy and a method for their production. The contact pins are provided with a nickel layer and coated with rhodium and/or platinum or with palladium. The contact pins may be additionally provided with a layer of gold. The contact pins are first cleaned by degreasing and activating, preferably by activating through acid etching. Thereafter, the application of a nickel layer is performed under a protective gas atmosphere, followed by formatting at 850 to 1050° C. The protective gas atmosphere is preferably made up of 10 to 100% hydrogen, with the balance formed of nitrogen. This is followed by a coating with palladium or with rhodium and platinum, or with platinum, or with rhodium and gold.

Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.

A process for forming an article having at least one precision surface is disclosed. The process includes providing a thin sheet in contact with a surface of a mandrel. The process then includes establishing a pressure differential between opposite sides of the thin sheet using a collapsible enclosure so that the thin sheet is drawn onto the mandrel surface, thereby causing the thin sheet to substantially conform to the shape of the mandrel surface. The shaped thin sheet is then secured to a support member to define the article. The article is then removed from the mandrel. The front surface of the thin sheet defines the precision surface of the article. A process for forming a dual-sided precision article is also disclosed, along with an adaptive optical system and method that employs the precision article.

A process for forming an article having at least one precision surface is disclosed. The process includes providing a thin sheet in contact with a surface of a mandrel. The process then includes establishing a pressure differential between opposite sides of the thin sheet using a collapsible enclosure so that the thin sheet is drawn onto the mandrel surface, thereby causing the thin sheet to substantially conform to the shape of the mandrel surface. The shaped thin sheet is then secured to a support member to define the article. The article is then removed from the mandrel. The front surface of the thin sheet defines the precision surface of the article. A process for forming a dual-sided precision article is also disclosed, along with an adaptive optical system and method that employs the precision article.

A method for manufacturing an optical element is a method for manufacturing an optical element in which laser light is transmitted, reciprocated, or reflected, and the method includes a first step of obtaining a bonded element formed by subjecting a first element part and a second element part, both being transparent to laser light, to surface activated bonding with a non-crystalline layer interposed therebetween; and after the first step, a second step of crystallizing at least a portion of the non-crystalline layer by raising the temperature of the bonded element. In the second step, the temperature of the bonded element is raised to a predetermined temperature that is lower than the melting points of the first element part and the second element part.

A light source device includes a substrate having a first surface, a plurality of light emitting elements disposed on the first surface side of the substrate, a bonding frame disposed on the first surface side of the substrate so as to surround the plurality of light emitting elements, and a cover disposed on an opposite side of the bonding frame to the substrate. The substrate has metal as a forming material. The cover includes a light transmissive member. The light transmissive member is opposed to the first surface of the substrate, and transmits the light emitted from the plurality of light emitting elements. The bonding frame is lower in thermal conductivity compared to the substrate.

A light source device includes a substrate having a first surface, a plurality of light emitting elements disposed on the first surface side of the substrate, a bonding frame disposed on the first surface side of the substrate so as to surround the plurality of light emitting elements, and a cover disposed on an opposite side of the bonding frame to the substrate. The substrate has metal as a forming material. The cover includes a light transmissive member. The light transmissive member is opposed to the first surface of the substrate, and transmits the light emitted from the plurality of light emitting elements. The bonding frame is lower in thermal conductivity compared to the substrate.