A pump-out tube for evacuating a space between two sheets of glass, the pump out tube being receivable in a hole formed in at least one of the sheets of glass, the pump out tube formed as a separate element comprising a tubular member and a seal formed around the tube.

A glass substrate contains, as a glass matrix composition as represented by mole percentage based on oxides, SiO.sub.2: 58-75%, Al.sub.2O.sub.3: 4.5-16%, B.sub.2O.sub.3: 0-6%, MgO: 0-6%, CaO: 0-6%, SrO: 5-20%, BaO: 5-20%, and MgO+CaO+SrO+BaO:15-40%. The glass substrate has an alkali metal oxide content of 0-0.1% as represented by mole percentage based on oxides. The glass substrate has an average coefficient of thermal expansion α of 56-90 (×10.sup.−7/° C.) at 50° C.-350° C.

Aspects of this disclosure relate to a method for selecting an adhesive for bonding a cold-formed glass to a metal substrate and various cold-formed products. In one or more embodiments, the cold-formed products include a structural substrate comprising a curved surface and structural substrate coefficient of thermal expansion (CTE), a cold-formed and curved glass substrate attached to the curved surface with an adhesive, the glass substrate comprising a glass substrate CTE, the structural substrate and adhesive forming a structural substrate/adhesive interface and the glass substrate and the adhesive forming a glass substrate/adhesive interface, wherein the glass substrate CTE and the structural substrate CTE differ, wherein the product withstands overlap shear failure as determined by modified test method ASTM D1002-10 at −40° C., 24° C., and 85° C. and tensile failure as determined by ASTM D897 at −40° C., 24° C., and 85° C. at one or both of the structural substrate/adhesive interface and the glass substrate/adhesive interface.

The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.

An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

A glass substrate contains, as a glass matrix composition as represented by mole percentage based on oxides, SiO.sub.2: 58-75%, Al.sub.2O.sub.3: 4.5-16%, B.sub.2O.sub.3: 0-6%, MgO: 0-6%, CaO: 0-6%, SrO: 5-20%, BaO: 5-20%, and MgO+CaO+SrO+BaO:15-40%. The glass substrate has an alkali metal oxide content of 0-0.1% as represented by mole percentage based on oxides. The glass substrate has an average coefficient of thermal expansion α of 56-90 (×10.sup.−7/° C.) at 50° C.-350° C.

Various embodiments for a laminate glass article having an integrated switch therein and related methods are provided. The laminated glass article a force sensor configured within one or more layers of the laminate with sufficient spacer incorporation to provide a force sensing switch. Related methods are also provided.