The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

A join is provided that has an electrically insulating component and two joining partners secured to one another and electrically insulated from one another by the electrically insulating component. The electrically insulating component has a surface that extends between the two joining partners. The surface defines a structure selected from a group consisting of an elevation, a depression, and any combinations thereof. The structure elongates a direct path along the surface. The structure completely surrounds at least one of the two joining partners. The electrically insulating component and/or the structure includes a glass that is at least partially crystallized.

An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

A method for curing adhesive during assembly of glass syringes, including: dispensing adhesive onto a glass syringe; and curing the adhesive using a UV LED line array. The method may include one or both of pre-curing the adhesive using a UV LED spot and heating at least one of the glass barrel, needle and adhesive at one or more points during the method. A system for curing an adhesive during assembly of a glass syringe, the system including: a dispensing station for dispensing the adhesive onto a glass barrel and needle; a pre-curing station for pre-curing the adhesive; a curing station for curing the adhesive; and at least one infrared heater for heating at least one of the glass barrel, needle and adhesive at one or more points in the system. The glass syringe may be operated on by a subset of the stations in the system.

Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.

An electronic device that can be worn on the body or introduced into the body includes: a casing having a top and a bottom and an inorganic support including an opening and composed of a plurality of components; and at least one window made of at least one of glass or glass ceramic provided on the bottom. The window is secured in the inorganic support and seals the opening in the inorganic support.

The disclosure relates to a bond produced with an at least partially crystallized glass, such as a metal-to-glass bond, in particular a metal-to-glass bond in a feed-through element or connecting element, and to a method for producing such a bond, in particular in a feed-through element or connecting element. The at least partially crystallized glass includes at least one crystal phase and pores which are distributed in the at least partially crystallized glass in a structured manner.

A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

A method for adhering embellishments to a glass substrate. The method provides a depression in the glass matching the shape of the embellishment, allowing for a lower profile and protecting the adhesive from water and solvents, thus reducing the chance of the embellishment falling off of the glass.