A pillar mounting method includes an accommodation step, a mounting step, and a displacement step. The accommodation step is a step of accommodating a plurality of pillars in storage with the plurality of pillars being stacked on each other. The mounting step is a step of pushing one pillar of the plurality of pillars accommodated in the storage out of the storage and mounting the one pillar on a substrate including a glass pane. The displacement step is a step of changing a relative location between the substrate and the storage. The mounting step and the displacement step are alternately repeated to mount the plurality of pillars in a predetermined arrangement on the substrate such that the plurality of pillars are apart from each other.

Methods for the production of a semiconductor device are disclosed. In one embodiment, a method may include: (1) mechanically contacting a first substrate (100) having a semiconductor material to a second substrate (200) having a bondable passivation material and contact vias (210) extending through the bondable passivation material; (2) covering the contact vias (210) with an at least high-resistance material (220, 300) on a side facing away from the first substrate (100); (3) applying an electric potential between the at least high-resistance material and the first substrate. The potential has a sufficient level that is functionally sufficient to initiate a bonding process between the bondable passivation material of the second substrate and the semiconductor material of the first substrate.

An insulating glass unit cooling assembly and method of cooling an insulating glass unit is provided. The cooling assembly includes a cooling unit that directs air at insulating glass units and a conveyor that transports insulating glass units along a path of travel defining an axis of travel for the insulating glass units. The conveyor has a conveyor planar surface that supports a corresponding planar glass surface of the insulating glass units as the insulating glass units are conveyed along the axis of travel such that the planar surface of the insulating glass units are substantially horizontal and substantially parallel to the conveyor planar surface. The air from the cooling unit is directed in a path substantially parallel with the conveyor planar surface and the planar glass surface of the insulating glass units as the insulating glass units travel along the conveyor.

A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.

A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.

A fire-resistant glazing unit includes a first untempered glass sheet, a second untempered glass sheet and a solid interlayer stack, wherein the interlayer stack includes a first intumescent layer, an essentially inorganic layer and a second intumescent layer.

A glass panel unit includes: a first substrate including a first glass panel; a second substrate including a second glass panel; and a frame-shaped sealing portion that is hermetically bonded to the first substrate and the second substrate. The sealing portion creates an evacuated space between the first substrate and the second substrate. When viewed from a region where the second substrate is positioned with respect to the first substrate, the first substrate includes a part arranged to stick out of an edge of the second substrate. The part includes a mounting portion used to mount the glass panel unit onto a vehicle.

Disclosed is an antenna on glass (AOG) device having an air cavity at least partially formed in a photosensitive glass substrate. An air cavity structure is at least partially encloses the air cavity and wherein the air cavity structure at least partially formed from the photosensitive glass substrate. An antenna is formed from portion of a top conductive layer disposed on a top surface of the air cavity structure and at least partially overlapping the air cavity. A metallization structure is provided having a bottom conductive layer disposed on a bottom surface of the air cavity structure, wherein the bottom conductive layer is electrically coupled to the top metal layer by a conductive pillar disposed through the photosensitive glass substrate. In addition, the AOG device may integrate one or more MIM capacitors and/or inductors that allow for RF filtering and impedance matching.

A glass unit according to the present invention includes a first glass plate having a through hole formed therein, a second glass plate that is arranged facing the first glass plate at a predetermined interval therefrom and forms an internal space with the first glass plate, a sealing member that seals a gap at peripheral edges of the first glass plate and the second glass plate, a cover that closes the through hole, and an adhesive that fixes the cover to the first glass plate. The internal space has been depressurized to a vacuum state, or a predetermined gas has been injected into the internal space, and the first glass plate and the cover are fixed by the adhesive.

A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes.