A manufacturing method of a glass panel unit includes an adhesive disposing step, a pillar disposition step of disposing a plurality of pillars on the first panel. Each of the plurality of pillars includes a plurality of resin layers to stacked on one another. In each of the plurality of pillars, a contact area being in contact with the first panel and being included in the resin layer which is in contact with the first panel is different from a contact area being in contact with the second panel and being included in the resin layer which is in contact with the second panel.

A method for the deposition of an organic intumescent coating on a glass sheet, includes the preparation of an organic intumescent coating composition by mixing a latex having a pH from 4 to 6 and an intumescent agent chosen from thermally degradable polycarboxylic acids, and the application of the organic intumescent coating composition to the glass sheet.

A glass panel unit assembly includes: a pair of glass substrates arranged to face each other; a peripheral wall; a partition; an air passage; and an evacuation port. The peripheral wall has a frame shape and is disposed between the pair of glass substrates. The partition partitions an internal space, surrounded with the pair of glass substrates and the peripheral wall, into a first space and a second space. The air passage connects the first space and the second space together. The evacuation port connects the second space to an external environment. The partition is lower in height than the peripheral wall.

A glass panel unit assembly includes: a pair of glass substrates arranged to face each other; a peripheral wall; a partition; an air passage; and an evacuation port. The peripheral wall has a frame shape and is disposed between the pair of glass substrates. The partition partitions an internal space, surrounded with the pair of glass substrates and the peripheral wall, into a first space and a second space. The air passage connects the first space and the second space together. The evacuation port connects the second space to an external environment. The partition is lower in height than the peripheral wall.

Provided is: a resin sheet having excellent characteristics as an optical member and exhibiting excellent performance when used in a light emitting device or the like; and a manufacturing method thereof. A curable silicone composition, comprises: (A) (a1) a straight chain or partially branched organopolysiloxane having an alkenyl group, and (a2) an organopolysiloxane having an alkenyl group, including an organopolysiloxane resin having an alkenyl group, comprising a certain amount of branched siloxane units; (B) (b1) a straight chain or partially branched organohydrogenpolysiloxane having a silicon-bonded hydrogen atom at an end of a molecular chain, (b2) an organohydrogenpolysiloxane, including a organohydrogenpolysiloxane resin, having a certain amount of branched siloxane units; and (C) a hydrosilylation reaction catalyst.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A glass panel unit assembly includes: glass substrates; a peripheral wall having a frame shape and disposed between the glass substrates; a partition; an evacuation port; and a plurality of air passages. The partition partitions an internal space into an evacuation space, a ventilation space, and a coupling space. The evacuation port connects the ventilation space to an external environment. The plurality of air passages includes: a first air passage connecting the evacuation space to the coupling space; and a second air passage connecting the coupling space to the ventilation space. The second air passage includes a particular air passage having a larger dimension than any of the first air passage.

A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.

A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.