C03C2214/04

Optoelectronic Component and Method for Producing an Optoelectronic Component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one laser source configured to emit at least one laser beam during operation and a self-supporting conversion element arranged in a beam path of the laser beam, wherein the self-supporting conversion element comprises a substrate followed by a first layer, the first layer being directly bonded to the substrate and comprising at least one conversion material embedded in a glass matrix, wherein the glass matrix has a proportion of 50 vol % to 80 vol % inclusive in the first layer, wherein the substrate is free of the glass matrix and of the conversion material and mechanically stabilize the first layer, and wherein the first layer has a layer thickness of less than 200 m.

GLASS/QUARTZ COMPOSITE SURFACE
20200002214 · 2020-01-02 ·

A glass/quartz composite structure comprises quartz grit, quartz powder and glass grit wherein the glass grit is in an amount greater than 50% by weight of the composite structure, and a binding resin. The glass/quartz composite structure may be formed into a 1.2-1.5 cm thick slab for countertops using standard cabinet perimeter support. The slab may be made by mixing the quartz grit, the quartz powder, the glass grit, and the binding resin, pouring the mixture in a mold, and compacting the mixture in the mold. Specific natural mineral components may be added to the glass/quartz/resin composite structure to provide aesthetics of specific natural stones.

WIRING BOARD
20240040694 · 2024-02-01 ·

A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a second glass and a second ceramic filler. A sintering temperature of the second glass contained in the second dielectric layer is higher than a sintering temperature of the wiring conductor, and a grain size of the second glass contained in the second dielectric layer is smaller than a grain size of the first glass contained in the first dielectric layer.

Glass powder, dielectric material, sintered body, and high frequency circuit member
11939258 · 2024-03-26 · ·

A glass powder of the present invention is a glass powder, which is formed of alkali borosilicate glass, wherein the glass powder includes 0.1 mol % to 1.0 mol %, provided that 1.0 mol % is excluded, of Li.sub.2O+Na.sub.2O+K.sub.2O in a glass composition, has a molar ratio Li.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.35 to 0.65, a molar ratio Na.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.25 to 0.55, and a molar ratio K.sub.2O/(Li.sub.2O+Na.sub.2O+K.sub.2O) of from 0.025 to 0.20, and has a specific dielectric constant at 25? C. and 16 GHz of from 3.5 to 4.0 and a dielectric dissipation factor at 25? C. and 16 GHz of 0.0020 or less.

ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING METAL NANOPARTICLES
20240098168 · 2024-03-21 ·

A composite enclosure component for an electronic device is disclosed. The composite enclosure component may include metallic nanoparticles, non-metallic nanoparticles, or a combination of these. The nanoparticles of the composite enclosure component may provide a hue, enhanced mechanical properties, or both.

GLASS/QUARTZ COMPOSITE SURFACE
20240067556 · 2024-02-29 ·

A glass/quartz composite structure may comprise aggregate including glass grit, nano-glass crystals, and/or amorphous silica that may be produced from crystalline quartz. The aggregate may be in an amount greater than any other single material by weight of the composite structure, which may further include quartz powder and/or alumina as well as a binding resin. The glass/quartz composite structure may be devoid of crystalline silica. The structure may be formed into a 1.2-1.5 cm thick slab for countertops using standard cabinet perimeter support. The slab may be made by mixing the aggregate, the quartz powder and/or alumina, and the binding resin, pouring the mixture in a mold, and compacting the mixture in the mold. Specific natural mineral components, decorative chips, and/or wet mixture pieces may be added to the composite structure to provide aesthetics of specific natural stones.

ZIRCONIA-TOUGHENED GLASS CERAMICS
20240051868 · 2024-02-15 ·

ZrO.sub.2-toughened glass ceramics having high molar fractions of tetragonal ZrO.sub.2 and fracture toughness value of greater than 1.8 MPa.Math.m.sup.1/2. The glass ceramic may also include also contain other secondary phases, including lithium silicates, that may be beneficial for toughening or for strengthening through an ion exchange process. Additional second phases may also decrease the coefficient of thermal expansion of the glass ceramic. A method of making such glass ceramics is also provided.

FIRING AID COMPOSED OF A COMPOSITE MATERIAL, COMPOSITE MATERIAL AND METHOD OF PRODUCTION THEREOF, AND USE THEREOF

A formulation usable to produce plates and shaped bodies has a base slip, quartz glass particles and multicomponent glass particles that are crystallizable or at least partly crystallized. The base slip contains water as dispersion medium with a content between 30% and 50% by weight and ultrafine SiO.sub.2 particles distributed, preferably colloidally therein, with a proportion between 50% and 70% by weight. The proportion of quartz glass particles in the formulation is in the range from 40% to 70% by weight and the proportion the multicomponent glass particles in the formulation is in the range from 5% to 37% by weight. The formulation can be used in a composite material. Firing aids can be made from the composite material.

Multilayer ceramic substrate and electronic device
10457608 · 2019-10-29 · ·

A multilayer ceramic substrate that includes a surface layer portion positioned on an internal layer portion, and a surface layer electrode on a surface of the surface layer portion. The surface layer portion includes a first layer next to the internal layer portion, and the internal layer portion includes a second layer next to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer. The first layer and the second layer each contain glass containing 40 weight % to 65 weight % of MO, where MO is at least one selected from CaO, MgO, SrO, and/or BaO); 35 weight % to 60 weight % of alumina, and 1 weight % to 10 weight % of at least one metal oxide selected from CuO and/or Ag.sub.2O.

Composite powder, green sheet, light reflective substrate, and light emitting device using same

A composite powder of the present invention includes a glass powder and a ceramic powder, wherein a content of the glass powder is from 30 vol % to 60 vol %, wherein a content of the ceramic powder is from 40 vol % to 70 vol %, wherein the glass powder includes as a glass composition, in terms of mass %, 10% to 30% of SiO.sub.2, more than 20% to 40% of B.sub.2O.sub.3, 20% to 40% of SrO+BaO, 0% to 10% of Al.sub.2O.sub.3, and 0% to 15% of ZnO, and wherein the composite powder is used for a light reflective substrate.