C03C2214/08

METHODS AND SYSTEMS FOR PROCESSING GLASS AND METHODS FOR REINFORCING GLASS PRODUCTS

A mixture including glass fragments is located in a containment vessel and is processed in a kiln to form a commercially useful building product. The mixture is initially heated over a first time period to a first temperature intermediate the glass transition point temperature and about 950 C. or 1,100 C. (Section A). At the first temperature the glass fragments slump and bond to each other and the mixture is soaked at this temperature for a second time period (Section B). After reducing the temperature (Section C), the mixture is annealed for another time period (Section D). Finally, the kiln is cooled to allow the mixture to be removed (Section E).

DECORATIVE COMPOSITION AND UTILIZATION THEREOF

The present disclosure provides a technology of obtaining a ceramic product including a decorative film which has a sufficient chemical resistance and can reduce damage during cleaning. A decorative composition disclosed herein contains at least a noble metal element and a glass matrix element. The glass matrix element contains a rare-earth element and a first element which is at least one selected from the group consisting of Si and Al. In the decorative composition disclosed herein, the content of the rare-earth element in the glass matrix element is from 1 mol % to 45 mol % inclusive, and the content of the first element in the glass matrix element is from 50 mol % to 90 mol % inclusive. This allows the decorative film having both alkali resistance and acid resistance at high level to be formed.

ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING METAL NANOPARTICLES
20240098168 · 2024-03-21 ·

A composite enclosure component for an electronic device is disclosed. The composite enclosure component may include metallic nanoparticles, non-metallic nanoparticles, or a combination of these. The nanoparticles of the composite enclosure component may provide a hue, enhanced mechanical properties, or both.

Glass based empty substrate integrated waveguide devices

The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.

COMPOSITION FOR FORMING SOLAR CELL ELECTRODE AND ELECTRODE PREPARED USING THE SAME
20190292092 · 2019-09-26 ·

A composition for solar cell electrodes and a solar cell electrode fabricated using the composition, the composition including a conductive powder; a glass frit; and an organic vehicle, wherein the glass frit has a reaction index (RI) of about 0.5 to about 1.0, as calculated according to Equation 1:


Reaction index (RI)=Ib/Ia<Equation 1> wherein, in Equation 1, Ia denotes a maximum peak intensity measured on a specimen at 20.5 to 20.7 (2) by XRD analysis, the specimen being obtained by mixing the glass frit with Si.sub.3N.sub.4 powder in a weight ratio of 1:1 to prepare pellets, followed by heat-treatment at 800 C. for 10 minutes, and Ib denotes a maximum peak intensity measured on the specimen at 20.75 to 20.95 (2) by XRD analysis.

CONDUCTIVE PASTE AND SOLAR CELL
20190194059 · 2019-06-27 · ·

Provided is a conductive paste for forming a bus bar electrode having high adhesive strength on a passivation film in a crystalline silicon solar cell without having a detrimental effect on the passivation film so as to affect solar cell properties. The conductive paste is a conductive paste for forming an electrode formed on a passivation film of a solar cell, containing: (A) conductive particles, (B) an organic vehicle, and (C) glass frit containing Bi.sub.2O.sub.3 at 10 mol % to 30 mol % and SiO.sub.2 at 5 mol % to 30 mol %, wherein the conductive paste contains the glass frit at 0.3 parts by weight to 2 parts by weight based on 100 parts by weight of the conductive particles.

COMPOSITION FOR FORMING ELECTRODE, ELECTRODE MANUFACTURED USING THE SAME AND SOLAR CELL
20190198689 · 2019-06-27 ·

A composition for forming an electrode for a solar cell includes a conductive powder, a glass frit, and an organic vehicle, the organic vehicle including a thickener including a structural unit represented by Chemical Formula 1,

##STR00001##

POLYCHROMATIC ARTICLES AND METHODS OF MAKING THE SAME

An article includes SiO.sub.2 from about 40 mol % to about 80 mol %, Al.sub.2O.sub.3 from about 1 mol % to about 20 mol %, B.sub.2O.sub.3 from about 3 mol % to about 50 mol %, WO.sub.3 plus MoO.sub.3 from about 1 mol % to about 18 mol % and at least one of: (i) Au from about 0.001 mol % to about 0.5 mol %, (ii) Ag from about 0.025 mol % to about 1.5 mol %, and (iii) Cu from about 0.03 mol % to about 1 mol %, and R.sub.2O from about 0 mol % to about 15 mol %. The R.sub.2O is one or more of Li.sub.2O, Na.sub.2O, K.sub.2O, Rb.sub.2O and Cs.sub.2O. R.sub.2O minus Al.sub.2O.sub.3 ranges from about 12 mol % to about 3.8 mol %.

Composition for forming solar cell electrode and electrode prepared using the same

A composition for solar cell electrodes including a conductive powder, a glass frit, and an organic vehicle. The glass frit contains tellurium (Te), sodium (Na), zinc (Zn), and at least one of lead (Pb) and bismuth (Bi). A molar ratio of the sum of lead and bismuth to zinc ranges from about 1 to about 20. A molar ratio of tellurium to sodium ranges from about 1 to about 15.

Methods and systems for processing glass and methods for reinforcing glass products

A mixture including glass fragments is located in a containment vessel and is processed in a kiln to form a commercially useful building product. The mixture is initially heated over a first time period to a first temperature intermediate the glass transition point temperature and about 950? C. or 1,100? C. (Section A). At the first temperature the glass fragments slump and bond to each other and the mixture is soaked at this temperature for a second time period (Section B). After reducing the temperature (Section C), the mixture is annealed for another time period (Section D). Finally, the kiln is cooled to allow the mixture to be removed (Section E).