A glass-ceramic-ferrite composition containing a glass, a ferrite, and a ceramic filler, in which the glass contains, by weight, about 0.5% to about 5.0% R.sub.2O (R represents at least one selected from the group consisting of Li, Na, and K), about 5.0% or less Al.sub.2O.sub.3, about 10.0% to about 25.0% B.sub.2O.sub.3, and about 70.0% to 85.0% SiO.sub.2 with respect to the total weight of the glass, the percentage by weight of the ferrite is about 10% to 80% with respect to the total weight of the composition, the ceramic filler contains at least forsterite selected from forsterite and quartz, the percentage by weight of the forsterite is about 1% to about 10% with respect to the total weight of the composition, and the percentage by weight of the quartz is about 40% or less with respect to the total weight of the composition.

A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m.sup.2; a fracture toughness greater than 1.0 MPam; and a haze less than 0.2.

A glass/quartz composite structure comprises quartz grit, quartz powder and glass grit wherein the glass grit is in an amount greater than 50% by weight of the composite structure, and a binding resin. The glass/quartz composite structure may be formed into a 1.2-1.5 cm thick slab for countertops using standard cabinet perimeter support. The slab may be made by mixing the quartz grit, the quartz powder, the glass grit, and the binding resin, pouring the mixture in a mold, and compacting the mixture in the mold. Specific natural mineral components may be added to the glass/quartz/resin composite structure to provide aesthetics of specific natural stones.

A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a second glass and a second ceramic filler. A sintering temperature of the second glass contained in the second dielectric layer is higher than a sintering temperature of the wiring conductor, and a grain size of the second glass contained in the second dielectric layer is smaller than a grain size of the first glass contained in the first dielectric layer.

ZrO.sub.2-toughened glass ceramics having high molar fractions of tetragonal ZrO.sub.2 and fracture toughness value of greater than 1.8 MPa.Math.m.sup.1/2. The glass ceramic may also include also contain other secondary phases, including lithium silicates, that may be beneficial for toughening or for strengthening through an ion exchange process. Additional second phases may also decrease the coefficient of thermal expansion of the glass ceramic. A method of making such glass ceramics is also provided.

An inductor component includes an element assembly formed of an insulator material and an inner electrode arranged in the element assembly. The insulator material contains a base material formed of an amorphous material containing B, Si, O, and K and a crystalline filler and includes a filler-poor glass portion in a region along the inner electrode. The content of the crystalline filler in the filler-poor glass portion is lower than the content of the crystalline filler in the element assembly excluding the filler-poor glass portion.

The lead-free glass composition contains vanadium oxide, tellurium oxide, alkaline metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO.sub.2. A content of the alkaline metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide R.sub.2O (R: alkali metal element).

The invention provides a porous glass ceramic composition manufactured using conventional raw materials and one or more waste materials, wherein the waste materials are capable of producing glass forming oxides, glass modifying oxides and pore forming oxides. The waste materials are selected from a group that includes cullet, pozzolanic waste and fly ash. The invention also provides a method for manufacturing the porous glass ceramic composition.

Disclosed is a bulk block for manufacturing a prosthesis having high aesthetics and processability required for one-day dental prosthetic materials, which is a dental composite bulk block comprising a glass ceramic matrix and a polymer, wherein the glass ceramic matrix consists of an amorphous glass matrix and a crystalline phase dispersed in the glass matrix, the crystalline phase comprises as a main crystalline phase at least one selected from a leucite crystalline phase and a lithium disilicate crystalline phase, and has an average particle diameter of 0.01-1.0 ?m, and the polymer is included in an amount of 20-40 wt % with respect to the weight of the total bulk block. The bulk block has the advantages of improved mechanical properties, being capable of preventing microleakage, exhibiting excellent aesthetics, and enabling machining.

A composite powder of the present invention includes a glass powder and a ceramic powder, wherein a content of the glass powder is from 30 vol % to 60 vol %, wherein a content of the ceramic powder is from 40 vol % to 70 vol %, wherein the glass powder includes as a glass composition, in terms of mass %, 10% to 30% of SiO.sub.2, more than 20% to 40% of B.sub.2O.sub.3, 20% to 40% of SrO+BaO, 0% to 10% of Al.sub.2O.sub.3, and 0% to 15% of ZnO, and wherein the composite powder is used for a light reflective substrate.