A process comprising: (i) coating particles of silicon carbide, silicon nitride, boron carbide or boron nitride with a metal alloy or metal layer; (ii) agglomerating the particles of step (i); thermally spraying the agglomerated metal or metal alloy coated particles onto a substrate to provide a coating thereon.

The present invention relates to a method for preparing a SiC—Si.sub.3N.sub.4 composite material and a SiC—Si.sub.3N.sub.4 composite material prepared according to same and comprises the steps of: preparing a mold; and forming a SiC—Si.sub.3N.sub.4 composite material by introducing, to the mold, a source gas comprising Si, N and C, at 1100 to 1600° C. More particularly, the present invention provides the SiC—Si.sub.3N.sub.4 composite material of high purity that is applicable to a semiconductor process, and increases the thermal shock strength of a SiC material by causing Si.sub.3N.sub.4, which is a material with a high thermal shock strength, to grow together via a CVD method.

The present invention relates to a method for preparing a SiC—Si.sub.3N.sub.4 composite material and a SiC—Si.sub.3N.sub.4 composite material prepared according to same and comprises the steps of: preparing a mold; and forming a SiC—Si.sub.3N.sub.4 composite material by introducing, to the mold, a source gas comprising Si, N and C, at 1100 to 1600° C. More particularly, the present invention provides the SiC—Si.sub.3N.sub.4 composite material of high purity that is applicable to a semiconductor process, and increases the thermal shock strength of a SiC material by causing Si.sub.3N.sub.4, which is a material with a high thermal shock strength, to grow together via a CVD method.

A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a binder and a primary material. The binder is configured to release a secondary material upon heating at or above a conversion temperature. The method also may include heating the fused filament fabricated component to a temperature at or above the conversion temperature to sinter the primary material to form a sintered part and cause the binder to release the secondary material within the sintered part.

Disclosed is a method for manufacturing a ceramic susceptor, the method including: preparing ceramic sheets; preparing a lamination structure of a molded body, in which the ceramic sheets are laminated and a conductive metal layer for electrodes is disposed between the ceramic sheet laminated products; and sintering the lamination structure of the molded body, wherein the preparing of the ceramic sheets includes: obtaining a vitrified first additive powder by heat-treating a slurry containing MgO, SiO.sub.2, and CaO; preparing a slurry by mixing an Al.sub.2O.sub.3 powder with the first additive powder, a second additive powder containing a MgO powder, and a third additive powder containing a Y.sub.2O.sub.3 powder; and forming the ceramic sheets by tape casting the slurry.

A coating fabrication method includes providing engineered granules and thermally consolidating the engineered granules on a substrate to form a silicate-resistant barrier coating. Each of the engineered granules is an aggregate of at least one refractory matrix region and at least one calcium aluminosilicate additive region (CAS additive region) attached with the at least one refractory matrix region. In the thermal consolidation, the refractory matrix region from the engineered granules form grains of a refractory matrix of the silicate-resistant barrier coating and the CAS additive region from the engineered granules form CAS additives that are dispersed in grain boundaries between the grains.

Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

A manufacturing method of a honeycomb structure including: a dry mixing step of dry-mixing raw materials to form the honeycomb structure by a batch treatment, a wet mixing step of adding a liquid including at least one selected from the group consisting of water, a surfactant, a lubricant and a plasticizer to a dry mixture obtained in the dry mixing step, to perform wet mixing, a kneading step of kneading a wet mixture obtained in the wet mixing step, and a forming step of extruding a forming material prepared in the kneading step, wherein in the dry mixing step, a used forming material passed through the forming step is added as a part of the raw material, to perform dry mixing, and the kneading step includes a liquid re-adding step of further adding the liquid in a process of kneading the wet mixture.

A mould for manufacturing a packing member from a liquid ceramic composition. The mould including a first part and a second part, in which the first and/or second mould parts are resiliently deformable and the first part and/or the second part include a plurality of open mould cavities. The first and second parts are operable to engage to form closed mould cavities, and the mould is operable to be moved from an open position in which the first and second parts are partially spaced by the deformation of a mould part and in which position mould cavities are open, to a partially closed position by reducing the deformation of the mould part and in which position some of the mould cavities are closed, and then to a closed position by further reducing the deformation of the mould part and in which position the first and second parts are engaged such that the mould cavities are closed.

In a processing method for a ceramic-based composite material in which the ceramic-based composite material is molded by layering sheets obtained by impregnating reinforced fibers with a slurry containing ceramic powder and calcining the sheets after curing, the processing method includes a step of layering the sheets in a layering direction to form a laminate, and a step of covering the laminate with a vacuum bag and evacuating the inside of the vacuum bag to mold a cured laminate. In the step of molding the cured laminate, a slurry-removing material configured to absorb excess slurry is disposed with respect to the laminate, and a degassing circuit member provided on at least one side of the laminate and configured to discharge air bubbles generated inside the laminate is disposed with respect to the laminate.