C04B37/001

Solid state battery fabrication

Embodiments of the invention generally relate to solid state battery structures, such as Li-ion batteries, methods of fabrication and tools for fabricating the batteries. One or more electrodes and the separator may each be cast using a green tape approach wherein a mixture of active material, conductive additive, polymer binder and/or solid electrolyte are molded or extruded in a roll to roll or segmented sheet/disk process to make green tape, green disks or green sheets. A method of fabricating a solid state battery may include: preparing and/or providing a green sheet of positive electrode material; preparing and/or providing a green sheet of separator material; laminating together the green sheet of positive electrode material and the green sheet of separator material to form a laminated green stack; and sintering the laminated green stack to form a sintered stack comprising a positive electrode and a separator.

COMPACT SENSOR COMPONENT FOR HARSH ENVIRONMENTS
20220113221 · 2022-04-14 · ·

A sensor component for application temperatures above 700° C., especially electrical and/or electrochemical sensor component is provided. The sensor component has a feedthrough element, the feedthrough element having a through-hole with a through-hole inner wall extending from one surface of the feedthrough element to the other surface of the feedthrough element, wherein an insulation element is located within a through-hole of the feedthrough element, the through-hole has a diameter Da, the insulation element has a Volume V and a height H which are compact.

Thermal Insulation
20220127152 · 2022-04-28 · ·

The present invention relates to inorganic fibres having a composition comprising: 61.0 to 70.8 wt% SiO.sub.2; 28.0 to 39.0 wt% CaO; 0.10 to 0.85 wt% MgO other components, if any, providing the balance up to 100 wt %,

The sum of SiO.sub.2 and CaO is greater than or equal to 98.8 wt % and the other components comprise less than 0.70 wt % Al.sub.2O.sub.3, if any.

Preparation method of indium oxide with stable morphology and application thereof
20220098052 · 2022-03-31 ·

A preparation method of indium oxide with stable morphology includes: (1) mixing indium oxide powder and bismuth oxide powder according to a mass ratio of 1:0.1-0.5 to obtain a powder mixture; (2) putting the powder mixture into a ball mill for ball milling at room temperature to obtain a uniform powder mixture; (3) putting the obtained uniform powder mixture into a muffle furnace and calcining at 700-1000° C.; and (4) obtaining the indium oxide with cubic stable morphology after the muffle furnace naturally cools to room temperature. The method has advantages of simple synthesis process, short synthesis period, high sample yield, no need of complicated equipment, and morphology of the obtained indium oxide can be maintained after being heated at a high temperature within 1000° C. for 2 hours. An electrochemical sensor prepared by using the indium oxide obtained by the method has better selectivity to nonane.

METHOD FOR REPAIRING COMPOSITE COMPONENTS AND ASSOCIATED INFILTRATION SYSTEMS AND METHODS

A method for repairing composite components includes positioning repair material within a repair region of a composite component formed of a composite material. Furthermore, the method includes heating the repair region to a first temperature. Additionally, the method includes heating a remaining portion of the composite component to a second temperature. Moreover, the method includes melt infiltrating the repair region with an infiltrant to densify the repair material. The first temperature is at or above a melting point of the infiltrant and the second temperature is less than the melting point.

COMPOSITE SINTERED BODY, SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER AND METHOD OF PRODUCING COMPOSITE SINTERED BODY

A composite sintered body includes a base material that contains Al.sub.2O.sub.3 as a main component, and an electrode arranged inside or on a surface of the base material. The electrode contains Ru, ZrO.sub.2, and Al.sub.2O.sub.3.

JOINED BODY AND SURFACE ACOUSTIC WAVE DEVICE

Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.

Component for semiconductor production device, and production method of component for semiconductor production device

A semiconductor production device component includes a first ceramic member including an AlN-based material, a second ceramic member including an AlN-based material, and a joint layer disposed between the first ceramic member and the second ceramic member so as to join the first ceramic member and the second ceramic member to each other. The joint layer includes a composite oxide containing Gd and Al, and Al.sub.2O.sub.3, and is free from AlN.

Ceramic having a residual compressive stress for use in electronic devices
11104616 · 2021-08-31 · ·

A toughened ceramic component having a residual compressive stress and methods of forming the toughened ceramic component is disclosed. The ceramic component may include an internal portion having a first coefficient of thermal expansion (CTE) and an external portion substantially surrounding the internal portion and forming an exterior surface of the ceramic component. The external portion may have a second CTE that is less than the first CTE. Additionally, the external portion may be in compressive stress.

Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.