C04B37/001

Wafer support
11764039 · 2023-09-19 · ·

A wafer support includes an RF electrode and a heater electrode that are embedded inside a disk-shaped ceramic base having a wafer placement surface. The RF electrode is constituted by a plurality of RF zone electrodes that are individually disposed for each of a plurality of divided zones of the wafer placement surface. The plurality of RF zone electrodes are separately disposed in at least two stages that are positioned at different distances from the wafer placement surface. The heater electrode is constituted by a plurality of heater zone electrodes that are individually disposed for each of a plurality of divided zones of the wafer placement surface, the zones being divided in a similar or different way to or from the RF zone electrodes.

LOW TEMPERATURE CO-FIREABLE DIELECTRIC MATERIALS

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

Substrate and Method for Producing the Substrate
20220024188 · 2022-01-27 ·

In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

HONEYCOMB BODY MANUFACTURING METHODS

Methods of firing ceramic honeycomb bodies are disclosed that include placing refractory particles on and end face of the green ceramic honeycomb body, and heating the green ceramic honeycomb body to a temperature of at least 600° C. to form a fired ceramic honeycomb body. The refractory particles prevents sticking of honeycomb-to-honeycomb during firing. A layer of refractory particles can also be used to replace a green cookie.

PROCESS FOR OBTAINING COMPOSITE, ULTRA-REFRACTORY, FIBRE-REINFORCED CERAMIC MATERIALS

The present invention relates to a process for preparing a composite, ultra-refractory, fibre-reinforced ceramic material obtained through the infiltration of carbon and/or silicon carbide fibres with a ceramic suspension comprising yttrium, lanthanum and/or scandium compounds, and the subsequent densification of the composite. The fibre-reinforced UHTC compounds obtained by the process can be used for making items intended for use in extreme temperature and pressure conditions.

METHOD OF MANUFACTURING EPITAXY SUBSTRATE

A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.

CO-FIRING OF LOW FIRING TEMPERATURE DIELECTRIC MATERIALS WITH HIGH BISMUTH GARNET FERRITES FOR MINIATURIZED ISOLATORS AND CIRCULATORS

A method of forming a composite material for use as an isolator or circulator in a radiofrequency device comprises providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure, inserting a high dielectric constant inner material having a dielectric constant above 30 within an aperture in the low temperature fireable outer material, and co-firing the lower temperature fireable outer material and the high dielectric constant inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric constant inner material to form an integrated magnetic/dielectric assembly without the use of adhesive or glue.

Method for manufacturing a guide vane from a ceramic matrix composite material

A method for manufacturing a turbine nozzle vane made of ceramic matrix composite material, wherein the vane is manufactured using a first fibrous preform including a hollow central section intended to form a fibrous reinforcement of an airfoil of the vane to be obtained, and a pair of second fibrous preforms each having an opening with a shape of the airfoil of the vane to be obtained.

INTEGRAL CERAMIC MATRIX COMPOSITE FASTENER WITH NON-POLYMER RIGIDIZATION
20220411334 · 2022-12-29 ·

A method of forming an integral fastener for a ceramic matrix composite component comprises the steps of forming a fiber preform with an opening, forming a fiber fastener, inserting the fiber fastener into the opening, and infiltrating a matrix material into the fiber preform and fiber fastener to form a ceramic matrix composite component with an integral fastener. A gas turbine engine is also disclosed.