Patent classifications
C04B37/003
CERAMIC BONDED BODY
A ceramic bonded body may include a first member, a second member, a joining layer between the first member and the second member, and a covering layer which covers the joining layer and is located over the first member and the second member. The first member and the second member may include aluminum nitride-based ceramic. The joining layer and the covering layer may include at least aluminum, calcium, yttrium, and oxygen where, in 100 mass % of all of the constituents configuring the joining layer and the covering layer, the aluminum is 21 mass % or more converted to oxides, the calcium is 21 mass % or more converted to oxides, and the sum of the aluminum and the calcium converted to oxides is 86 mass % or more. The covering layer has a content of yttrium converted to oxides greater than that of the joining layer.
COMPOSITE SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC DEVICE
A composite substrate includes a supporting substrate and a functional substrate that are directly joined together, the supporting substrate being a sintered sialon body.
Preparation method of heat-resistant adhesive of silicon-boron-carbon-zirconium modified aluminum-zirconium phosphate for zirconium oxide ceramics
A preparation method of heat-resistant adhesive of silicon-boron-carbon-zirconium modified aluminum-zirconium phosphate for zirconium oxide ceramics is provided. The high-temperature adhesive can generate various high-temperature resistant phases such as zirconia, aluminum phosphate, zirconium phosphate and aluminum borate in situ of the high-temperature adhesive at high temperatures. As the processing temperature increases, the content of zirconia in the high-temperature adhesive continuously increases, and the composition tends to form a stable composite phase mainly composed of aluminum phosphate and zirconia, which makes the composition of the high-temperature adhesive closer to that of zirconia ceramics.
Piezoelectric element with lithium manganate-containing ceramic layers and silver-containing internal electrodes
A multilayer piezoelectric element using an alkaline niobate-based piezoelectric ceramic, which can inhibit its reliability from dropping while lowering production cost, is characterized by forming internal electrodes (10) with a metal whose silver content is 80 percent by mass or higher, and also constituting piezoelectric ceramic layers (40) with a piezoelectric ceramic whose primary component is an alkaline niobate having a perovskite structure and which also contains a lithium manganate.
Capacitor component
A capacitor component includes a body including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The dielectric layer includes dielectric grains, at least a portion of the dielectric grains has a core-shell structure, and a shell of the core-shell structure contains a rare earth element having an average concentration of more than 0.5 at %.
Ceramic joined body and method for manufacturing same
A ceramic joined body includes a first aluminum oxide-based sintered body, a second aluminum oxide-based sintered body, an aluminum oxide-based joint layer located between the first aluminum oxide-based sintered body and the second aluminum oxide-based sintered body, and an aluminum oxide-based protrusion connected to the aluminum oxide-based joint layer, where the average diameter for closed pores of the aluminum oxide-based projection is 0.8 times or more and 1.5 times or less as large as the average diameter for closed pores for each of the first aluminum oxide-based sintered body and the second aluminum oxide-based sintered body.
METHODS FOR MANUFACTURING CERAMIC AND CERAMIC COMPOSITE COMPONENTS AND COMPONENTS MADE THEREBY
Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600 C. without a significant reduction in thermal and mechanical properties.
POLYCRYSTALLINE CERAMIC SUBSTRATE, BONDING-LAYER-INCLUDING POLYCRYSTALLINE CERAMIC SUBSTRATE, AND LAMINATED SUBSTRATE
Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<.sub.1/.sub.2<0.9 and relational expression (2) 0.7<.sub.3/.sub.4<0.9 holds, where .sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30 C. to 300 C. and .sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30 C. to 300 C., and .sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30 C. to 1000 C. and .sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30 C. to 1000 C.
APPARATUS AND METHOD OF MANUFACTURING CERAMIC HONEYCOMB BODY
An apparatus and method of manufacturing a porous ceramic segmented honeycomb body (340,340) comprising axial channels (216) extending from a first end face (220) to a second end face (224). A plurality of porous ceramic honeycomb segments (204) is moved axially past respective apertures (110) of an adhesive applying device (100). Adhesive (118) is applied through openings (126) in the adhesive applying device (100) onto peripheral axial surfaces of each porous ceramic honeycomb segment (204). The plurality of porous ceramic honeycomb segments (204) enters a wide opening (318) of a tapered chamber (314) and exits a narrow opening (322) of the tapered chamber (314); a tapered wall (326) from the wide opening (318) to the narrow opening (322) presses the plurality of porous ceramic honeycomb segments (204) together forming the porous ceramic segmented honeycomb body (340,340). The adhesive (118) on the peripheral axial surfaces between respective porous ceramic honeycomb segments (204) is distributed by the pressing.
METHODS FOR REPAIRING COMPOSITE CYLINDERS
Methods for repairing composite cylindrical components are provided. One exemplary method for repairing a cylindrical component defining an axial direction, a radial direction, and a circumferential direction includes removing a damaged region of the cylindrical component. A flange extending from a cylindrical body of the cylindrical component is included in the damaged region. One or more arc segments that extend along the circumferential direction are connected with the existing cylindrical component. At least one of the arc segments includes a prefabricated flange. One or more plies are laid up to connect the arc segments with the existing cylindrical component to repair the damaged region of the cylindrical body and the prefabricated flange formed integrally with one of the arc segments replaces the damaged portion of the flange. Repaired cylindrical components are also provided.