A gas plug of the present disclosure is composed of a columnar porous composite in which a plurality of silicon compound phases containing silicon carbide as a main component are connected to each other via a silicon phase having silicon as a main component. The porous composite is housed inside a tubular body made from a dense ceramic.

The disclosure discloses a method for preparing a multifunctional ecological exterior wall, including: preparing a ceramic board of a ceramic thermal insulation waterproof layer; preparing a ceramic sound-absorbing board of a sound-absorbing layer; and installing a ecological exterior wall: leveling a surface of the wall of a building with cement slurry, and applying a cement bonding layer thereon; laying the ceramic thermal insulation waterproof board on the cement bonding layer, and applying the cement bonding layer on the ceramic board; laying the ceramic sound-absorbing board on the cement bonding layer and reserving a gap used to place a pipe; driving the screw-thread steel bolt from the surface of the ceramic sound-absorbing board into the wall obliquely; installing and fixing the pipe in the gap, which is reserved at the upper of the ceramic sound-absorbing board; planting a green plant on the surface of the ceramic board of the sound-absorbing layer.

A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces facing each other in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the first and second side surfaces; thermocompression-bonding a first side margin sheet to the first side surface; forming a first side margin by punching the thermocompression-bonded first side margin sheet with the first side surface; thermocompression-bonding a second side margin sheet to the second side surface, the second side margin sheet including a bonding surface having a higher flexibility than the first side margin formed on the first side surface; and forming a second side margin by punching the thermocompression-bonded second side margin sheet with the second side surface.

An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C.

A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.

A turbomachine part of an annular assembly includes a structural body and a connecting edge integral with the structural body. Each connecting edge includes at least one groove intended to receive a sealing tab. Each connecting edge is made of composite material including a fibrous reinforcement consisting of randomly-oriented short fibres, the reinforcement being densified by a ceramic matrix.

A composite ceramic atomizer includes a first main body and a second main body that are integrally formed by using a glazing and sealing process, and the first main body is connected to the second main body through a glazed surface formed by glazing. The glazed surface completely or partially covers a surface at the joint between the first main body and the second main body. The first main body includes a heating carrier and a conductive path for heating, where the conductive path is formed on a surface of or inside the heating carrier and has a first contact part and a second contact part connected to a power supply. The second main body is used for liquid conduction. Further provided is a method for preparing the composite ceramic atomizer.

The present invention discloses a dielectric ceramic formula enabling one to obtain a multilayer ceramic capacitor by alternatively stacking the ceramic dielectric layers and base metal internal electrodes. The dielectric ceramic composition comprises a primary ingredient:
[(Na.sub.1-xK.sub.x).sub.sA.sub.1-s].sub.m[(Nb.sub.1-yTa.sub.y).sub.uB1.sub.vB2.sub.w)]O.sub.3 wherein: A, B1, B2, x, y, s, u, v, w and m are defined.

A ceramic joined body includes: a pair of ceramic plates; and an electrode layer that is interposed between the pair of ceramic plates, in which the electrode layer is embedded in at least one of the pair of ceramic plates, and in an outer edge of the electrode layer, a joint surface between the at least one of the pair of ceramic plates and the electrode layer has an inclination with respect to a thickness direction of the pair of ceramic plates and the electrode layer.

Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600° C. without a significant reduction in thermal and mechanical properties.