A pillar shaped honeycomb structure includes: a porous partition wall that defines a plurality of cells, the cells forming flow paths for a fluid, the cells extending from an inflow end face to an outflow end face; and an outer peripheral wall located at the outermost circumference. The cells include: a plurality of cells A wherein a side of the inflow end face is opened and the outflow end face has a plugged portion; and a plurality of cells B wherein a side of the outflow end face is opened and the inflow end face has a plugged portion, the cells B being arranged alternately with the cells A. One or both of the plugged portion of the cells A and the plugged portions of the cells B contain a magnetic substance and glass.

A pillar shaped honeycomb structure includes: a porous partition wall that defines a plurality of cells, the cells forming flow paths for a fluid, the cells extending from an inflow end face to an outflow end face; and an outer peripheral wall located at the outermost circumference. The cells include: a plurality of cells A wherein a side of the inflow end face is opened and the outflow end face has a plugged portion; and a plurality of cells B wherein a side of the outflow end face is opened and the inflow end face has a plugged portion, the cells B being arranged alternately with the cells A. One or both of the plugged portion of the cells A and the plugged portions of the cells B contain a magnetic substance and glass.

A fired ceramic article including a screen printed layer of primer on a portion of the fired ceramic body. The thickness of the primer layer is less than 25 microns. A machine-readable code is laser marked onto the screen printed layer of primer. Methods of marking a ceramic article are also provided.

A fired ceramic article including a screen printed layer of primer on a portion of the fired ceramic body. The thickness of the primer layer is less than 25 microns. A machine-readable code is laser marked onto the screen printed layer of primer. Methods of marking a ceramic article are also provided.

Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

Embodiments of the present application generally relate to methods for forming a plurality of gratings. The methods generally include depositing a material over one or more protected regions of a waveguide combiner disposed on a substrate, the material having a thickness inhibiting removal of a grating material disposed on the waveguide combiner when an ion beam is directed toward the substrate, and directing the ion beam toward the substrate. The methods disclosed herein allow for formation of a plurality of gratings in one or more unprotected regions, while no gratings are formed in the protected regions.

A scribe line is formed on a first surface of a nitride ceramic base material by a laser. Next, the nitride ceramic base material is divided along the scribe line. The scribe line includes a plurality of recessed portions. The plurality of recessed portions are formed in a row on the first surface of the nitride ceramic base material. A depth of each of the plurality of recessed portions is equal to or greater than 0.70 times and equal to or smaller than 1.10 times an opening width of each of the plurality of recessed portions. The opening width of each of the plurality of recessed portions is equal to or greater than 1.00 times and equal to or smaller than 1.10 times an inter-center distance of the plurality of recessed portions.

The THz waveguides disclosed herein are used to transmit signals having a THz frequency in the range from 0.1 THz to 10 THz and include an alumina core surrounded by an optional cladding. The core may have a diameter (D1) in the range from 10 μm to 500 μm and may be comprised of a ceramic ribbon having a dielectric constant (Dk). The optional cladding may have a dielectric constant (Dk) less than the core. The THz waveguides can be formed using a continuous firing process and nano-perforation technology that enables access to a wide form factor range. In one example, rectangular waveguides, or ribbons, may be fabricated in the 10 μm to 200 μm thick range at widths in the range from sub-millimeters to several meters and lengths in the range from millimeters to several hundred meters.

A ceramic green sheet including a plurality of substrate forming regions. A barcode or a two-dimensional code is drawn in a portion of the ceramic green sheet. The barcode or the two-dimensional code is obtained by encoding one or more of the following information. Information relating to raw materials used when the ceramic green sheet is produced, information relating to molding conditions of the ceramic green sheet, information relating to a release agent used when a plurality of the ceramic green sheets are stacked, or a serial number.

A ceramic green sheet including a plurality of substrate forming regions. A barcode or a two-dimensional code is drawn in a portion of the ceramic green sheet. The barcode or the two-dimensional code is obtained by encoding one or more of the following information. Information relating to raw materials used when the ceramic green sheet is produced, information relating to molding conditions of the ceramic green sheet, information relating to a release agent used when a plurality of the ceramic green sheets are stacked, or a serial number.