A method for etching a light absorbing material permits directly writing a pattern of etching of silicon nitride and other light absorbing materials, without the need of a lithographic mask, and allows the creation of etched features of less than one micron in size. The method can be used for etching deposited silicon nitride films, freestanding silicon nitride membranes, and other light absorbing materials, with control over the thickness achieved by optical feedback. The etching is promoted by solvents including electron donor species, such as chloride ions. The method provides the ability to etch silicon nitride and other light absorbing materials, with fine spatial and etch rate control, in mild conditions, including in a biocompatible environment. The method can be used to create nanopores and nanopore arrays.

A method for etching a light absorbing material permits directly writing a pattern of etching of silicon nitride and other light absorbing materials, without the need of a lithographic mask, and allows the creation of etched features of less than one micron in size. The method can be used for etching deposited silicon nitride films, freestanding silicon nitride membranes, and other light absorbing materials, with control over the thickness achieved by optical feedback. The etching is promoted by solvents including electron donor species, such as chloride ions. The method provides the ability to etch silicon nitride and other light absorbing materials, with fine spatial and etch rate control, in mild conditions, including in a biocompatible environment. The method can be used to create nanopores and nanopore arrays.

A knife includes a blade having a first side face and a second side face. The blade includes zirconia as a main component, and includes a cutting region including at least a ridge portion between the first side face and the second side face. When a portion including the cutting region in the first side face is referred to as a first cutting face, and a portion including the cutting region in the second side face is referred to as a second cutting face, the proportion of cubic crystals of zirconia in the first cutting face is larger than the proportion of cubic crystals of zirconia in the second cutting face.

A knife includes a blade having a first side face and a second side face. The blade includes zirconia as a main component, and includes a cutting region including at least a ridge portion between the first side face and the second side face. When a portion including the cutting region in the first side face is referred to as a first cutting face, and a portion including the cutting region in the second side face is referred to as a second cutting face, the proportion of cubic crystals of zirconia in the first cutting face is larger than the proportion of cubic crystals of zirconia in the second cutting face.

A method for preparing metal oxide and ceramic oxide nano- and microparticulate materials is described herein. The method comprises irradiating a precursor material with high energy pulsed-light flashes in an oxygen-containing atmosphere. The precursor materials comprise thin films, fibers, or particles of subnano-, nano-, or microscale dimension, which are composed of metal ions dispersed in an amorphous or partially crystalline polymer matrix in a ratio necessary to form target metal oxide or ceramic oxide when reacted with oxygen (i.e., the precursor material does not include any metal oxide phase). The irradiation of the precursor material in an oxygen-containing atmosphere decomposes and removes the polymers and anions from the precursor, and also oxidizes the metal ions within the precursor materials to form metal oxide or ceramic oxide particulates.

One aspect of the present disclosure is a method for evaluating adhesiveness performance and heat radiation performance of a composite including a porous sintered ceramic component and a semi-cured product of a resin filled into pores of the sintered ceramic component, including a step of emitting ultraviolet rays to the surface of the semi-cured product of the composite; a step of measuring an emission intensity of fluorescence generated from the semi-cured product; and a step of evaluating adhesiveness performance and heat radiation performance of the composite using the value of the emission intensity.

One aspect of the present disclosure is a method for evaluating adhesiveness performance and heat radiation performance of a composite including a porous sintered ceramic component and a semi-cured product of a resin filled into pores of the sintered ceramic component, including a step of emitting ultraviolet rays to the surface of the semi-cured product of the composite; a step of measuring an emission intensity of fluorescence generated from the semi-cured product; and a step of evaluating adhesiveness performance and heat radiation performance of the composite using the value of the emission intensity.

A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

According to one or more embodiments of the present invention, a mirrored apparatus includes a substrate with a non-metal inorganic material that is non-diamond turnable. The mirrored apparatus further includes a finish layer arranged on the surface of the substrate. The finish layer has a polished surface opposite the substrate. The mirrored apparatus also includes a reflective layer arranged on the polished surface of the finish layer.