C04B41/009

Systems, devices, and methods for manufacturing carbon ceramic brake discs
11702370 · 2023-07-18 · ·

Systems, devices, and methods are provided for manufacturing a carbon ceramic brake disc. Generally, a plurality of uncured or partially-cured bulk molding compound preforms or molding compound layers and ventilation cores are placed in a mold cavity and warm-pressed at a first temperature. The ventilation cores are removed from the resulting cured green body. The cured green body is then removed from the mold, and treated through a polymer infiltration and pyrolysis or reactive melt infiltration process. Certain steps can be repeated until a desired target density or weight is attained.

Mildewproof and antirot high-strength cement particle board and preparation method thereof

Technical fields of building external wall decoration and material manufacturing, providing a mildewproof and antirot high-strength cement particle board and a preparation method thereof. The preparation method includes: (1) sequentially carbonizing and water-washing a shaving, and mixing the obtained carbonized shaving with a cement gelling agent, a curing agent aqueous solution and water to obtain a mixture; (2) molding the mixture to obtain a pre-molded material; and (3) sequentially curing and drying the pre-molded material to obtain the mildewproof and antirot high-strength cement particle board. Compared to ordinary cement particle board, which is not subjected to carbonization treatment and water-washing, the cement particle board of the present invention can effectively avoid mildew and rot, and can significantly improve the mechanical strength and durability thereof, helping to extend the service life of the cement particle board.

METHOD FOR PRODUCING A CEMENTITIOUS BOARD, APPARATUS FOR PRODUCING A CEMENTITIOUS BOARD, AND CEMENTITIOUS BOARD

Method for producing a cementitious board (1), wherein a first liner (2) with first overlap sections (5) is provided and furnished with at least one layer of at least one slurry comprising a cementitious material (3); a second liner (4) with second overlap sections (8) is provided and arranged such that it contacts the first overlap sections (5) of the first liner (2), wherein the at least one layer of the at least one slurry (3) is arranged between the first liner (2) and the second liner (4); an adhesive foam (6) is provided at least partly on at least one of the first or second overlap sections (5, 8); and the first liner (2) and the second liner (4) are bonded via the adhesive foam (6) in the overlap sections (5, 8).

Post deposition heat treatment of coating on ceramic or ceramic matrix composite substrate

In one example, a method for forming an environmental barrier coating (EBC) and/or abradable coating on a substrate. The method may include depositing a coating on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited coating, wherein the coating includes at least one of an environmental barrier coating (EBC) and an abradable coating. The method further comprises heat treating the as-deposited coating at or above a first temperature for a first period of time following the deposition of the as-deposited coating on the substrate, wherein heat treating the as-deposited coating includes heating the as-deposited coating to or above the first temperature at a controlled rate. The heat treatment may be configured to at least one of decrease the open pores and/or microcracks of the heat-treated coating compared to the as-deposited coating or control a grain size of the heat-treated coating.

Post deposition heat treatment of coating on ceramic or ceramic matrix composite substrate

In one example, a method for forming an environmental barrier coating (EBC) and/or abradable coating on a substrate. The method may include depositing a coating on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited coating, wherein the coating includes at least one of an environmental barrier coating (EBC) and an abradable coating. The method further comprises heat treating the as-deposited coating at or above a first temperature for a first period of time following the deposition of the as-deposited coating on the substrate, wherein heat treating the as-deposited coating includes heating the as-deposited coating to or above the first temperature at a controlled rate. The heat treatment may be configured to at least one of decrease the open pores and/or microcracks of the heat-treated coating compared to the as-deposited coating or control a grain size of the heat-treated coating.

Gypsum wallboard with enhanced fire resistance, and related coatings and methods

Disclosed are an organic binder-based coating; a composite gypsum board containing face and back cover sheets, an outside surface of the back cover sheet bearing the coating; and a method of preparing composite board where the back cover sheet contains the coating on its outer surface. The coating is formed from a composition comprising an alkaline silicate, a solid filler, and optionally, a borate. An enhancing layer can also be applied to the back cover sheet.

Gypsum wallboard with enhanced fire resistance, and related coatings and methods

Disclosed are an organic binder-based coating; a composite gypsum board containing face and back cover sheets, an outside surface of the back cover sheet bearing the coating; and a method of preparing composite board where the back cover sheet contains the coating on its outer surface. The coating is formed from a composition comprising an alkaline silicate, a solid filler, and optionally, a borate. An enhancing layer can also be applied to the back cover sheet.

Method for producing a metal-ceramic substrate with at least one via
11557490 · 2023-01-17 · ·

A method for producing a metal-ceramic substrate with electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

SILICON CARBON COMPOSITES COMPRISING ULTRA LOW Z

Silicon-carbon composite materials and related processes are disclosed that overcome the challenges for providing amorphous nano-sized silicon entrained within porous carbon. Compared to other, inferior materials and processes described in the prior art, the materials and processes disclosed herein find superior utility in various applications, including energy storage devices such as lithium ion batteries.

SILICON CARBON COMPOSITES COMPRISING ULTRA LOW Z

Silicon-carbon composite materials and related processes are disclosed that overcome the challenges for providing amorphous nano-sized silicon entrained within porous carbon. Compared to other, inferior materials and processes described in the prior art, the materials and processes disclosed herein find superior utility in various applications, including energy storage devices such as lithium ion batteries.