A manufacturing system includes a tape advancing through the manufacturing system and a station of the manufacturing system. The tape includes a first portion having grains of an inorganic material bound by an organic binder. The station of the manufacturing system receives the first portion of the tape and prepares the tape for sintering by chemically changing the organic binder and/or removing the organic binder from the first portion of the tape, leaving the grains of the inorganic material, to form a second portion of the tape and, at least in part, prepare the tape for sintering.

A ceramic electronic component includes a body, including a dielectric layer and an internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell, surrounding at least a portion of the core, and a second shell, surrounding at least a portion of the first shell. The dual shell includes different types of rare earth elements R1 and R2, and R2.sub.S1/R1.sub.S1 is 0.01 or less and R2.sub.S2/R1.sub.S1 is 0.5 to 3.0, where R1.sub.S1 and R1.sub.S2 denote concentrations of R1 included in the first shell and the second shell, respectively, and R2.sub.S1 and R2.sub.S2 denote concentrations of R2 included in the first shell and the second shell, respectively.

A cermet contains hard phase particles containing Ti and a binding phase containing at least one of Ni and Co, and 70% or more (by number) of the hard phase particles have a cored structure containing a core and a peripheral portion around the core. The core is composed mainly of at least one of Ti carbide, Ti nitride, and Ti carbonitride, and the peripheral portion is composed mainly of a Ti composite compound containing Ti and at least one selected from W, Mo, Ta, Nb, and Cr. The core has an average particle size α, the peripheral portion has an average particle size β, and α and β satisfy 1.1≦β/α≦1.7.

A method for manufacturing a part made of composite material in which an adhesion promoter is grafted to a coating present on the fibre surface as well as to a ceramic precursor resin. Afterwards, a ceramic matrix phase is formed in the porosity of the fibre preform by pyrolysis of the polymerised resin.

The invention relates to a material for storing and releasing oxygen, consisting of a reactive ceramic made of copper, manganese and iron oxides, wherein, subject to the oxygen partial pressure of a surrounding atmosphere and/or an ambient temperature, the reactive ceramic has a transition region that can be passed through any number of times, said transition region being between a discharge threshold state of a three-phase crednerite/cuprite/hausmannite mixed ceramic and a charge threshold state of a two-phase spinel/tenorite mixed ceramic. A passing through of the transition region from the discharge threshold state towards the charging threshold state is associated with oxygen uptake and a passing through of the transition region from the charge threshold state towards the discharge threshold state is associated with oxygen release.

A process for producing a molded insulating part, a molded insulating part and a casting tool for the production of an inorganic pulp composed of water, glass fibers and/or mineral fibers and sheet silicate, introduction of the pulp into a cavity of a casting tool whose wall is at least partially water-permeable, which cavity has on at least one side the negative shape of the molded insulating part to be produced, removal of the aqueous fraction present in the pulp, opening of the casting tool and subsequent taking-out of the molded insulating part produced. The pulp produced using water for producing the molded insulating part comprised a glass fiber/sheet silicate mixture or mineral fiber/sheet silicate mixture has a proportion of exclusively synthetic sheet silicate (5) in the range from 0.5% to 2.5% and a proportion of glass fibers and/or mineral fibers (4) of from 0.3 to 1.5%.

Some phosphor powders can be difficult to form into ceramic compacts because they are difficult to sinter. As described herein, phosphor powders that can degrade under conventional sintering temperatures can be sintered by heating the powder at a lower temperature, such as less than 800° C., while the powder is under greater than atmospheric pressure, such as at least 0.05 GPa. Phosphor ceramic compacts prepared by this method, and light-emitting devices incorporating these phosphor ceramic compacts, are also described.

A manufacturing system includes a tape advancing through the manufacturing system and a station of the manufacturing system. The tape includes a first portion having grains of an inorganic material bound by an organic binder. The station of the manufacturing system receives the first portion of the tape and prepares the tape for sintering by chemically changing the organic binder and/or removing the organic binder from the first portion of the tape, leaving the grains of the inorganic material, to form a second portion of the tape and, at least in part, prepare the tape for sintering.

A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.

A method for manufacturing a pillar-shaped honeycomb structure filter including preparing a pillar-shaped honeycomb structure having a plurality of first cells and a plurality of second cells that are alternately arranged adjacent to each other with a porous partition wall interposed therebetween; adhering ceramic particles containing 50% by mass or more in total of one or two selected from SiC and SiN to a surface of the first cells; and performing a heat-oxidation treatment on the pillar-shaped honeycomb structure in which the ceramic particles are adhered to the surface of the first cells to form a porous film comprised of the ceramic particles having an oxide film thereon so as to satisfy: (1) 0.05≤T≤0.5; (2) 0.05≤T/D50; and (3) 4≤{(W.sub.1−W.sub.0)/W.sub.0×100}/D50.