An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

A resist composition comprising a base polymer and a quencher containing a sulfonium salt having an iodized benzene ring offers a high sensitivity, minimal LWR and improved CDU independent of whether it is of positive or negative tone.

A resist composition comprising a base polymer and a quencher containing a sulfonium salt having an iodized benzene ring offers a high sensitivity, minimal LWR and improved CDU independent of whether it is of positive or negative tone.

Provided are: a resist material having high sensitivity and improved LWR (line width roughness) and CDU (critical dimension uniformity) for both of positive-type and negative-type resists; and a patterning process using this resist material: a resist material, including, as a quencher: a sulfonium salt of a substituted or unsubstituted hydroxy(trifluoromethoxy)benzoic acid; and/or a sulfonium salt of a substituted or unsubstituted hydroxy(trifluoromethylthio)benzoic acid.

Provided are: a resist material having high sensitivity and improved LWR (line width roughness) and CDU (critical dimension uniformity) for both of positive-type and negative-type resists; and a patterning process using this resist material: a resist material, including, as a quencher: a sulfonium salt of a substituted or unsubstituted hydroxy(trifluoromethoxy)benzoic acid; and/or a sulfonium salt of a substituted or unsubstituted hydroxy(trifluoromethylthio)benzoic acid.

Chemical syntheses and medical uses of novel inhibitors of the uptake of monoamine neurotransmitters and pharmaceutically acceptable salts and prodrugs thereof, for the treatment and/or management of psychotropic disorders, anxiety disorder, generalized anxiety disorder, depression, post-traumatic stress disorder, obsessive-compulsive disorder, panic disorder, hot flashes, senile dementia, migraine, hepatopulmonary syndrome, chronic pain, nociceptive pain, neuropathic pain, painful diabetic retinopathy, bipolar depression, obstructive sleep apnea, psychiatric disorders, premenstrual dysphoric disorder, social phobia, social anxiety disorder, urinary incontinence, anorexia, bulimia nervosa, obesity, ischemia, head injury, calcium overload in brain cells, drug dependence, and/or premature ejaculation are described.

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Chemical syntheses and medical uses of novel inhibitors of the uptake of monoamine neurotransmitters and pharmaceutically acceptable salts and prodrugs thereof, for the treatment and/or management of psychotropic disorders, anxiety disorder, generalized anxiety disorder, depression, post-traumatic stress disorder, obsessive-compulsive disorder, panic disorder, hot flashes, senile dementia, migraine, hepatopulmonary syndrome, chronic pain, nociceptive pain, neuropathic pain, painful diabetic retinopathy, bipolar depression, obstructive sleep apnea, psychiatric disorders, premenstrual dysphoric disorder, social phobia, social anxiety disorder, urinary incontinence, anorexia, bulimia nervosa, obesity, ischemia, head injury, calcium overload in brain cells, drug dependence, and/or premature ejaculation are described.

##STR00001##

The present disclosure relates, in general, to 5-halo-3,6-dichlorosalicylic acid compounds, 5-halo-3,6-dichlorosalicyaldehyde compounds, processes for preparing 5-halo-3,6-dichlorosalicylic acid compounds, processes for preparing 5-halo-3,6-dichlorosalicyaldehyde compounds, processes for preparing 3,6-dichlorosalicylic acid compounds, and processes that employ such compounds as intermediates in the preparation of the herbicide dicamba.

The present disclosure relates, in general, to 5-halo-3,6-dichlorosalicylic acid compounds, 5-halo-3,6-dichlorosalicyaldehyde compounds, processes for preparing 5-halo-3,6-dichlorosalicylic acid compounds, processes for preparing 5-halo-3,6-dichlorosalicyaldehyde compounds, processes for preparing 3,6-dichlorosalicylic acid compounds, and processes that employ such compounds as intermediates in the preparation of the herbicide dicamba.

The invention provides synthetic processes and synthetic intermediates that can be used to prepare a compound of formula (I): or a salt thereof.