The present invention provides an organic material composition and applications thereof. By the combination of the compounds comprised in the organic material composition, the organic material composition makes the element have a lower driving voltage, a higher current efficiency and a longer service life.

A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.

A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.

A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.

A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.

A method for preparing a latent hardener includes, in the order recited, introducing a hardener into a dry mixer that is a high-energy-type mixer; injecting carbon dioxide gas or an inert gas into the dry mixer; and mechanochemically deactivating only a surface of the hardener using the dry mixer. The hardener may be an amine-based adduct, an imidazole-based adduct, dicyandiamide, a dihydride-based compound, a dichlorophenyl dimethylurea compound and combinations thereof. The inert gas may be helium, nitrogen, argon, neon, krypton, and combinations thereof.

A method for preparing a latent hardener includes, in the order recited, introducing a hardener into a dry mixer that is a high-energy-type mixer; injecting carbon dioxide gas or an inert gas into the dry mixer; and mechanochemically deactivating only a surface of the hardener using the dry mixer. The hardener may be an amine-based adduct, an imidazole-based adduct, dicyandiamide, a dihydride-based compound, a dichlorophenyl dimethylurea compound and combinations thereof. The inert gas may be helium, nitrogen, argon, neon, krypton, and combinations thereof.

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

The present specification discloses a latent hardener in which only the surface of the hardener is selectively deactivated under a carbon dioxide or inert gas atmosphere, a one-component epoxy adhesive including the same, and a preparation method thereof.

Provided are methods and compositions for the treating a patient with a urea cycle disorder. Methods and compositions are also provided for modulating genes encoding enzymes that participate in the urea cycle by altering gene signaling networks.