The present invention relates to a method of preparing a vinyl chloride-based polymer composite, which comprises dispersing a vinyl chloride-based monomer in water (Step 1); polymerizing the dispersed vinyl chloride-based monomer with an initiator to prepare a polymer slurry by (Step 2); and adding a phosphite to the polymer while drying the polymer slurry, to prepare a vinyl chloride-based polymer composite (Step 3), and a vinyl chloride-based polymer composite prepared by the method and a vinyl chloride-based polymer composite composition.

The invention relates to a fluorinated copolymers which are particularly based on vinylidene fluoride (VDF) or trifluoroethylene (TrFE) and particularly functionalized by functional and/or functionizable vinyl ethers. The invention also relates to methods for producing said copolymers, and to the applications thereof.

The invention relates to a fluorinated copolymers which are particularly based on vinylidene fluoride (VDF) or trifluoroethylene (TrFE) and particularly functionalized by functional and/or functionizable vinyl ethers. The invention also relates to methods for producing said copolymers, and to the applications thereof.

A method of conjugating a substrate includes exchanging a counter ion associated with a biomolecule with a lipophilic counter ion to form a biomolecule complex, dispersing the biomolecule complex in a nonaqueous solvent, and coupling the biomolecule complex to a substrate in the presence of the nonaqueous solvent.

A method of conjugating a substrate includes exchanging a counter ion associated with a biomolecule with a lipophilic counter ion to form a biomolecule complex, dispersing the biomolecule complex in a nonaqueous solvent, and coupling the biomolecule complex to a substrate in the presence of the nonaqueous solvent.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

A polymer compound, which is used as a binder for a negative electrode of an electricity storage device, is obtained by condensation of a vinyl polymer that contains a carboxyl group and a third compound that is selected from among an aromatic multifunctional amine, phosphorous acid, phosphorous acid ester, trialkoxysilane, and phosphoric acid.

A polymer compound, which is used as a binder for a negative electrode of an electricity storage device, is obtained by condensation of a vinyl polymer that contains a carboxyl group and a third compound that is selected from among an aromatic multifunctional amine, phosphorous acid, phosphorous acid ester, trialkoxysilane, and phosphoric acid.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

A polymer complex is disclosed which is the reaction product of one or more polymers having a terminal or pendant hydroxyl group, or a terminal or pendent carboxyl group, or combinations thereof, with at least one metal complex and one alkyl phosphate. This polymer complex acts as an adhesion promotion agent as well as a viscosity stabilizer when formulated in a printing ink or coating.