An unsaturated deoxybenzoin compound has the structure (I)

##STR00001##

wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, and n are defined herein. A polymer including at least one group derived from a deoxybenzoin compound having structure (I), (II), or a combination thereof

##STR00002##

is also described, wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, and n are defined herein.

Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

##STR00001##

Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.

Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.

Provided are a composition for forming an adhesive film for imprinting, including a resin having a specific aromatic ring and a polymerizable functional group in a side chain, in which the specific aromatic ring is an unsubstituted aromatic ring, or an aromatic ring having one or more substituents, in which a formula weight of each of the one or more substituents is 1000 or less, and a proportion of a polymerizable functional group including a heterocyclic ring in the polymerizable functional group is less than 3 mol %; an adhesive film to which the composition for forming an adhesive film is applied; a laminate; a method for manufacturing a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.

According to the present invention, as a monomer which is unlikely to be crystallized in a curable composition for manufacturing an optical member and which enables manufacture of a cured product having a high level of moisture-heat resistance, a compound represented by General Formula (A) is provided. ##STR00001## In the formula, Ar.sup.11 and Ar.sup.12 each independently represent an aryl group or a heteroaryl group; X.sup.1, Y.sup.1, X.sup.2, Y.sup.2, Z.sup.1, and Z.sup.2 each independently represent a nitrogen atom or a carbon atom, or the like; Ar.sup.13 and Ar.sup.14 each independently represent an arylene group or a heteroarylene group, where at least one of Ar.sup.13 or Ar.sup.14 is a group other than a phenylene group; R.sup.3 to R.sup.6 each independently represent a substituent, q and r each independently are an integer of 0 to 4, and v and w each independently are an integer of 0 or more; L.sup.1 and L.sup.2 each independently represent a single bond, an oxygen atom, an ester bond, or the like; R.sup.11 and R.sup.12 each independently represent a divalent linking group containing a branched alkylene group; and R.sup.21 and R.sup.22 each independently represent a hydrogen atom or a methyl group.

According to the present invention, as a monomer which is unlikely to be crystallized in a curable composition for manufacturing an optical member and which enables manufacture of a cured product having a high level of moisture-heat resistance, a compound represented by General Formula (A) is provided. ##STR00001## In the formula, Ar.sup.11 and Ar.sup.12 each independently represent an aryl group or a heteroaryl group; X.sup.1, Y.sup.1, X.sup.2, Y.sup.2, Z.sup.1, and Z.sup.2 each independently represent a nitrogen atom or a carbon atom, or the like; Ar.sup.13 and Ar.sup.14 each independently represent an arylene group or a heteroarylene group, where at least one of Ar.sup.13 or Ar.sup.14 is a group other than a phenylene group; R.sup.3 to R.sup.6 each independently represent a substituent, q and r each independently are an integer of 0 to 4, and v and w each independently are an integer of 0 or more; L.sup.1 and L.sup.2 each independently represent a single bond, an oxygen atom, an ester bond, or the like; R.sup.11 and R.sup.12 each independently represent a divalent linking group containing a branched alkylene group; and R.sup.21 and R.sup.22 each independently represent a hydrogen atom or a methyl group.

The disclosure relates to polymers obtained by polymerizing in the presence of a Bronsted acid or a Lewis acid catalyst, a monomer comprising a 1,3-diisoalkenylarene, a 1,4-diisoalkenylarene, or mixtures thereof. The polymer comprises at least one of repeat units (A), (B), (C), and (D); wherein R.sup.1 is H or a C1-C8 alkyl group.

##STR00001##

The polymers have high T.sub.g and exhibit good solubility in non-polar solvents, forming substantially gel-free solutions. The polymers are useful for producing crosslinked materials having good physical properties. The crosslinked materials are valuable for further downstream uses, such as copper clad laminates.