Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1):

##STR00001##

(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

A method includes forming spherical liquid droplets of a first liquid phase containing a polymer precursor dispersed in a second liquid phase, where nanowires are located at an interface of the first and the second liquid phase and the nanowires extend with their longest axis substantially perpendicular to a surface of the spherical liquid droplets, and polymerizing the polymer precursor in the spherical liquid droplets to form beads including a solid polymer core and multiple nanowires aligned with their longest axis substantially perpendicular to a surface of the solid polymer core.

Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1): ##STR00001##
(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1): ##STR00001##
(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

A temozolomide compound according to formula (I) ##STR00001##
is described, wherein R.sup.1, L.sup.1, and X are defined herein. The temozolomide compound can be used to prepare polymers comprising temozolomide. Additionally, the polymers comprising temozolomide can be particularly useful in the treatment of certain diseases.

A temozolomide compound according to formula (I) ##STR00001##
is described, wherein R.sup.1, L.sup.1, and X are defined herein. The temozolomide compound can be used to prepare polymers comprising temozolomide. Additionally, the polymers comprising temozolomide can be particularly useful in the treatment of certain diseases.

Provided are a composition for forming a primer layer capable of improving wettability of a curable composition for imprinting on a substrate while maintaining imprinting performance, a kit, a primer layer, and a laminate.

The composition for forming a primer layer which is used for forming a primer layer contains: a polymerizable compound having a viscosity of 200 to 2,000 mPa.Math.s at 23 C.; and a solvent, in which a content of the polymerizable compound in a nonvolatile component contained in the composition is greater than or equal to 30 mass %, a content of the solvent in the composition is greater than or equal to 98.0 mass %, and the primer layer is a liquid film in a case where a curable composition for imprinting is applied onto a surface of the primer layer, and the primer layer and the curable composition for imprinting are soluble to each other.

Novel stress-reducing crosslinking oligomers that have application in dental restoratives, thin films, hardcoats, composites, adhesives, and other uses subject to stress reduction are described. The addition-fragmentation process of crosslinking results in a chain-transfer event that provides novel polymers that may be further functionalized. In addition, the addition-fragmentation oligomer comprises pendent functional groups that bond to a substrate by forming an ionic or covalent bond, or etch the substrate by chemically removing some material from the substrate.

A problem is to provide a fine resin particle formed by a simple method and capable of preventing fine resin particles from dropping out from substrates or binders and imparting scratch resistance to films, and a fine resin particle-containing composition. A solution is to provide a fine resin particle obtained by polymerizing one or two or more vinylic monomers and, in an infrared spectrum measured by an ATR method with an infrared spectrophotometer, having an absorbance ratio (B)/(A) in a range of 0.020 to 0.060 between the maximum peak height (maximum absorbance) (A) in a wavenumber range from 1700 cm.sup.?1 to 1800 cm.sup.?1 and the maximum peak height (maximum absorbance) (B) in a wavenumber range from 1600 cm.sup.?1 to 1700 cm.sup.?1.

The present invention provides a curable composition comprising (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100? C. and can be also thermally curable and radiation curable. The present curable composition exhibits favorable adhesion strength on various substrates when cured.