The present invention provides amic acids and imides derived from a polymer comprising: (a) maleic anhydride, (b) a first C.sub.1-C.sub.7 alkyl vinyl ether monomer, and (c) a second C.sub.8-C.sub.30 alkyl vinyl ether monomer, wherein the polymer contains an amic acid or an imide group. The polymers containing an amic acid or an imide group of the invention may be employed in a wide variety of compositions, particularly in oral care compositions. Non-limiting generic structures of the amidic polymers are set out below: (I) wherein R.sub.1-R.sub.3, M, a, b, c, d, e, and f are defined herein. ##STR00001##

The present invention provides amic acids and imides derived from a polymer comprising: (a) maleic anhydride, (b) a first C.sub.1-C.sub.7 alkyl vinyl ether monomer, and (c) a second C.sub.8-C.sub.30 alkyl vinyl ether monomer, wherein the polymer contains an amic acid or an imide group. The polymers containing an amic acid or an imide group of the invention may be employed in a wide variety of compositions, particularly in oral care compositions. Non-limiting generic structures of the amidic polymers are set out below: (I) wherein R.sub.1-R.sub.3, M, a, b, c, d, e, and f are defined herein. ##STR00001##

The present invention provides a stereolithographic article adhesive composition having excellent adhesiveness with respect to a shaped article produced by stereolithography. The present invention relates to a stereolithographic article adhesive composition comprising a multifunctional (meth)acrylic-based polymerizable monomer (A) and a photopolymerization initiator (B). The multifunctional (meth)acrylic-based polymerizable monomer (A) preferably contains at least one of a urethanated (meth)acrylic acid ester compound (a-1), an aromatic compound-based (meth)acrylic acid ester compound (a-2) containing no urethane bond, and a (meth)acrylamide group-containing polymerizable monomer (a-3).

A method of forming a resist pattern, including: step A in which a first resist pattern is formed on a substrate, step B in which a basic composition is applied to cover the first resist pattern, step C in which a base contained in the basic composition and the first resist pattern are neutralized to form a developing solution insoluble region on a surface of the first resist pattern, and step D in which the covered first resist pattern is developed, the basic composition containing a basic component, and the basic component containing a polymeric compound having a structural unit (x0) represented by general formula (x0-1) (R is H, C.sub.15 alkyl group, C.sub.15 halogenated alkyl group; Vx.sup.01 is divalent hydrocarbon group having ether bond or amide bond or divalent aromatic hydrocarbon group; Yx.sup.01 is single bond or divalent linking group; Rx.sup.1 is substituent having nitrogen atom). ##STR00001##

A method of forming a resist pattern, including: step A in which a first resist pattern is formed on a substrate, step B in which a basic composition is applied to cover the first resist pattern, step C in which a base contained in the basic composition and the first resist pattern are neutralized to form a developing solution insoluble region on a surface of the first resist pattern, and step D in which the covered first resist pattern is developed, the basic composition containing a basic component, and the basic component containing a polymeric compound having a structural unit (x0) represented by general formula (x0-1) (R is H, C.sub.15 alkyl group, C.sub.15 halogenated alkyl group; Vx.sup.01 is divalent hydrocarbon group having ether bond or amide bond or divalent aromatic hydrocarbon group; Yx.sup.01 is single bond or divalent linking group; Rx.sup.1 is substituent having nitrogen atom). ##STR00001##

The present invention provides amic acids and imides derived from a polymer comprising: (a) maleic anhydride, (b) a first C.sub.1-C.sub.7 alkyl vinyl ether monomer, and (c) a second C.sub.8-C.sub.30 alkyl vinyl ether monomer, wherein the polymer contains an amic acid or an imide group. The polymers containing an amic acid or an imide group of the invention may be employed in a wide variety of compositions, particularly in oral care compositions. Non-limiting generic structures of the amidic polymers are set out below: (I) wherein R.sub.1-R.sub.3, M, a, b, c, d, e, and f are defined herein.

##STR00001##

A process for the synthesis of a compound of formula (I):

##STR00001## wherein w, x, y and z are as defined in the description.

The process includes reacting a compound of formula (II):

##STR00002## with carbonyldiimidazole, and reacting the resulting compound with propargylamine.