C08F26/06

COMPOSITION FOR RESIST UNDERLAYER AND PATTERN FORMATION METHOD USING SAME

Provided are a resist underlayer composition including a polymer having a ring backbone including two or more nitrogen atoms in a ring, a compound represented by Chemical Formula 1, and a solvent; and a method of forming patterns using the resist underlayer composition:

##STR00001##

The definitions of Chemical Formula 1 are as described in the detailed description.

IMPROVED SOLUTION-PROCESSABLE TRIAZOLE-BASED POLYMERS AND METHODS OF MAKING THE SAME
20220298274 · 2022-09-22 ·

Disclosed herein are polymers comprising at least one alkyne functional group, at least one azide functional group, and a conformational bend outside of coplanarity of 30 or greater. Also disclosed herein are methods of making and using the same.

IMPROVED SOLUTION-PROCESSABLE TRIAZOLE-BASED POLYMERS AND METHODS OF MAKING THE SAME
20220298274 · 2022-09-22 ·

Disclosed herein are polymers comprising at least one alkyne functional group, at least one azide functional group, and a conformational bend outside of coplanarity of 30 or greater. Also disclosed herein are methods of making and using the same.

FLAME RESISTANT BUILD MATERIALS AND ASSOCIATED PRINTED 3D ARTICLES
20220289984 · 2022-09-15 ·

Polymerizable liquids for 3D printing applications are described herein which, in some embodiments, impart flame resistant and/or flame retardant properties to articles printed from the liquids. The polymerizable liquids may also impart desirable mechanical properties to the articles. In some embodiments, a polymerizable liquid comprises a curable isocyanurate component in an amount of at least 5 wt. %, based on total weight of the polymerizable liquid, and a brominated acrylate ester component. Additionally, methods of printing three-dimensional articles using said polymerizable liquids are described herein.

FLAME RESISTANT BUILD MATERIALS AND ASSOCIATED PRINTED 3D ARTICLES
20220289984 · 2022-09-15 ·

Polymerizable liquids for 3D printing applications are described herein which, in some embodiments, impart flame resistant and/or flame retardant properties to articles printed from the liquids. The polymerizable liquids may also impart desirable mechanical properties to the articles. In some embodiments, a polymerizable liquid comprises a curable isocyanurate component in an amount of at least 5 wt. %, based on total weight of the polymerizable liquid, and a brominated acrylate ester component. Additionally, methods of printing three-dimensional articles using said polymerizable liquids are described herein.

Polymers, methods for preparing same, and uses thereof particularly for metal capture

Disclosed are novel polymers that contain monomer units derived from 4-vinylpyridine and monomer units derived from a co-monomer. The polymers may be complexed with a metal, and linear or crosslinked. Also disclosed are methods for preparing these polymers by radical polymerization, as well as to their use for metal capture in aqueous media, particularly uranium capture in seawater or in final nuclear waste from nuclear power plants.

Photocurable resin composition, ink and coating material

The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: ##STR00001## wherein each R.sup.1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH.sub.2—CR.sup.3═CHR.sup.2 wherein R.sup.2 and R.sup.3 each represent H or CH.sub.3, provided that at least one R.sup.1 is the group —CH.sub.2—CR.sup.3═CHR.sup.2.

Photocurable resin composition, ink and coating material

The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: ##STR00001## wherein each R.sup.1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH.sub.2—CR.sup.3═CHR.sup.2 wherein R.sup.2 and R.sup.3 each represent H or CH.sub.3, provided that at least one R.sup.1 is the group —CH.sub.2—CR.sup.3═CHR.sup.2.

CONDUCTOR, CONDUCTIVE COMPOSITION AND LAMINATE

The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×10.sup.10Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

CONDUCTOR, CONDUCTIVE COMPOSITION AND LAMINATE

The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×10.sup.10Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.