This invention relates to a process for forming a long-chain branched polymer and a long-chain branched polymer resulting from the process. The process comprises reacting (a) a polyolefin base polymer with (b) a coupling agent comprising a polymeric coupling agent, optionally blended with a molecular coupling agent, the polymeric coupling agent being a modified polyolefin having a reactive coupling group at one or more terminal ends of the modified polyolefin chain, to couple the polyolefin base polymer (a) with the coupling agent (b) to form a long-chain branched polymer having a long-chain branching and/or higher surface energy relative to the polyolefin base polymer.

This invention relates to a process for forming a long-chain branched polymer and a long-chain branched polymer resulting from the process. The process comprises reacting (a) a polyolefin base polymer with (b) a coupling agent comprising a polymeric coupling agent, optionally blended with a molecular coupling agent, the polymeric coupling agent being a modified polyolefin having a reactive coupling group at one or more terminal ends of the modified polyolefin chain, to couple the polyolefin base polymer (a) with the coupling agent (b) to form a long-chain branched polymer having a long-chain branching and/or higher surface energy relative to the polyolefin base polymer.

This invention relates to a process for forming a long-chain branched polymer and a long-chain branched polymer resulting from the process. The process comprises reacting (a) a polyolefin base polymer with (b) a coupling agent comprising a polymeric coupling agent, optionally blended with a molecular coupling agent, the polymeric coupling agent being a modified polyolefin having a reactive coupling group at one or more terminal ends of the modified polyolefin chain, to couple the polyolefin base polymer (a) with the coupling agent (b) to form a long-chain branched polymer having a long-chain branching and/or higher surface energy relative to the polyolefin base polymer.

This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials, pre-treating substrate materials to improve the adhesion of resin compositions to the substrate materials, and/or controlling gel formation of resin compositions. More particularly, the invention relates to compositions and methods for improving the adhesion of ring opening metathesis polymerization (ROMP) compositions to substrate materials using adhesion promoters containing isocyanate groups in a resin composition. The invention also relates to methods for improving the adhesion of resin compositions to substrate materials by pre-treating substrate materials with adhesion promoters containing isocyanate groups. The invention further relates to a method of providing a gel-modified ROMP composition, in which a hydroperoxide is added to a ROMP polymerizable resin composition in order to control gel formation of the polymerizing resin. An improved ROMP composition is further disclosed, comprising a cyclic olefin, a ROMP metathesis catalyst, an adhesion promoter, and an added hydroperoxide gel modifier. The polymer products produced via ROMP reactions of the invention may be utilized for a wide range of materials and composite applications. The invention has utility in the fields of catalysis, organic synthesis, and polymer and materials chemistry and manufacture.

This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials, pre-treating substrate materials to improve the adhesion of resin compositions to the substrate materials, and/or controlling gel formation of resin compositions. More particularly, the invention relates to compositions and methods for improving the adhesion of ring opening metathesis polymerization (ROMP) compositions to substrate materials using adhesion promoters containing isocyanate groups in a resin composition. The invention also relates to methods for improving the adhesion of resin compositions to substrate materials by pre-treating substrate materials with adhesion promoters containing isocyanate groups. The invention further relates to a method of providing a gel-modified ROMP composition, in which a hydroperoxide is added to a ROMP polymerizable resin composition in order to control gel formation of the polymerizing resin. An improved ROMP composition is further disclosed, comprising a cyclic olefin, a ROMP metathesis catalyst, an adhesion promoter, and an added hydroperoxide gel modifier. The polymer products produced via ROMP reactions of the invention may be utilized for a wide range of materials and composite applications. The invention has utility in the fields of catalysis, organic synthesis, and polymer and materials chemistry and manufacture.

The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C.sub.2 to C.sub.9 alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C.sub.1 to C.sub.7 alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (a-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C.sub.2 to C.sub.9 alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C.sub.1 to C.sub.7 alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (a-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

Provided is a radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

Provided is a radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C.sub.2 to C.sub.9 alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C.sub.1 to C.sub.7 alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.