The present invention relates to a process for preparing a fluoropolymer in a liquid reaction medium, comprising the following steps: provide a reactor containing a liquid reaction medium comprising water introduce in said reactor ethylene monomers and fluorinated monomers, said fluorinated monomers being selected from tetrafluoroethylene (TFE), chlorotrifluoroethylene (CTFE) or mixtures thereof, pressurize the reactor, initiate polymerization feeding into said reactor a redox initiator comprising an oxidising agent and a reducing agent, wherein said reducing agent in said redox couple initiator is free from sulphur atoms having an oxidation number of 4 or below, wherein the reaction medium is free of fluorinated surfactants.

The present invention relates to a process for preparing a fluoropolymer in a liquid reaction medium, comprising the following steps: provide a reactor containing a liquid reaction medium comprising water introduce in said reactor ethylene monomers and fluorinated monomers, said fluorinated monomers being selected from tetrafluoroethylene (TFE), chlorotrifluoroethylene (CTFE) or mixtures thereof, pressurize the reactor, initiate polymerization feeding into said reactor a redox initiator comprising an oxidising agent and a reducing agent, wherein said reducing agent in said redox couple initiator is free from sulphur atoms having an oxidation number of 4 or below, wherein the reaction medium is free of fluorinated surfactants.

A hot melt pressure sensitive adhesive composition comprises: (a) a block copolymer comprising a first polymer block comprising an ethylene residue and a second polymer block comprising a C.sub.1 to C.sub.4 alkyl acrylate residue, wherein the block copolymer has a melt index as measured in accordance with ASTM D1238 of between about 0.1 and about 250 g/10 min; (b) a tackifying resin; and (c) a plasticizer. A method for making a laminate comprises the steps of: applying the hot melt pressure sensitive adhesive composition of the invention in a molten state to a primary substrate and allowing the adhesive to cool to form a bond with said primary substrate. Certain adhesives the invention perform comparably to certain styrene block copolymer adhesives, but provides an alternative polymer source.

A hot melt pressure sensitive adhesive composition comprises: (a) a block copolymer comprising a first polymer block comprising an ethylene residue and a second polymer block comprising a C.sub.1 to C.sub.4 alkyl acrylate residue, wherein the block copolymer has a melt index as measured in accordance with ASTM D1238 of between about 0.1 and about 250 g/10 min; (b) a tackifying resin; and (c) a plasticizer. A method for making a laminate comprises the steps of: applying the hot melt pressure sensitive adhesive composition of the invention in a molten state to a primary substrate and allowing the adhesive to cool to form a bond with said primary substrate. Certain adhesives the invention perform comparably to certain styrene block copolymer adhesives, but provides an alternative polymer source.

A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A copolymer of ethylene and a 1,3-diene, containing more than 50 mol % of ethylene units and containing 1,2-cyclohexanediyl units is provided. The 1,3-diene is 1,3-butadiene or a mixture of 1,3-dienes containing 1,3-butadiene, and the copolymer consists of a main chain and one or more side chains.

A copolymer of ethylene and a 1,3-diene, containing more than 50 mol % of ethylene units and containing 1,2-cyclohexanediyl units is provided. The 1,3-diene is 1,3-butadiene or a mixture of 1,3-dienes containing 1,3-butadiene, and the copolymer consists of a main chain and one or more side chains.

A copolymer of ethylene and a 1,3-diene, containing more than 50 mol % of ethylene units and containing 1,2-cyclohexanediyl units is provided. The 1,3-diene is 1,3-butadiene or a mixture of 1,3-dienes containing 1,3-butadiene, and the copolymer consists of a main chain and one or more side chains.

A curable composition includes an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying conditions (1) to (4) and an additive resin, which is at least one of a hydrocarbon-based elastomer, polyphenylene ether, olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer, and aromatic polyene-based resin. (1) The number average molecular weight of the copolymer is 5000 to 100000. (2) The aromatic vinyl compound monomer has 8 to 20 carbon atoms, and the content of the unit of the monomer is 0 to 70 mass %. (3) The aromatic polyene is selected from polyenes having 5 to 20 carbon atoms and a plurality of vinyl and/or vinylene groups in the molecule, and the content of the groups is 1.5 to 20 pieces per number average molecular weight. (4) The olefin is selected from olefins having 2 to 20 carbon atoms, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.