C08F212/34

Compositions and Polymer Films

A polymer film obtainable by polymerising a composition comprising: (a) a compound Formula (I); wherein: R is C.sub.1-4-alkyl, NH.sub.2 or C.sub.6-12-aryl; and M.sup.+ is a cation; (b) a monomer comprising at least two polymerisable groups; and (c) a solvent. Also claimed are compositions and processes for making the polymer films.

##STR00001##

Novel Polymer and Organic Light Emitting Device Comprising the Same

The present invention provides a novel polymer and an organic light emitting device including the same.

Novel Polymer and Organic Light Emitting Device Comprising the Same

The present invention provides a novel polymer and an organic light emitting device including the same.

Polymerizable Composition, Polymer Capsule and Fabric Softener Composition Comprising the Same

A polymerizable composition, polymer capsules and a fabric softener composition are provided. The fabric softener composition includes polymer capsules in which cationic groups are introduced on the surfaces thereof, so that early release of a fragrance can be suppressed and aromas can be generated depending on rupture of a shell material of the polymer capsules by light friction at certain times. In addition, the polymer capsules have high adhesion to fibers and are not attached to fibers during washing to minimize the discharged fragrance, so that sufficient aromas can be provided even if a small amount of fragrance is used.

Polymerizable Composition, Polymer Capsule and Fabric Softener Composition Comprising the Same

A polymerizable composition, polymer capsules and a fabric softener composition are provided. The fabric softener composition includes polymer capsules in which cationic groups are introduced on the surfaces thereof, so that early release of a fragrance can be suppressed and aromas can be generated depending on rupture of a shell material of the polymer capsules by light friction at certain times. In addition, the polymer capsules have high adhesion to fibers and are not attached to fibers during washing to minimize the discharged fragrance, so that sufficient aromas can be provided even if a small amount of fragrance is used.

Coating Composition, Organic Light-Emitting Diode Using Same, and Method for Preparing Same

A coating composition, an organic light emitting device using the same, and a method for manufacturing the same are disclosed herein. In some embodiments, a coating composition including a compound represented by Formula 1 and a compound represented by Formula 2. In some embodiments, an organic light emitting device includes a first electrode, a second electrode, and an organic material layer having one or more layers provided between the first electrode and the second electrode, wherein the one or more layers comprise the coating composition or a cured product thereof.

Coating Composition, Organic Light-Emitting Diode Using Same, and Method for Preparing Same

A coating composition, an organic light emitting device using the same, and a method for manufacturing the same are disclosed herein. In some embodiments, a coating composition including a compound represented by Formula 1 and a compound represented by Formula 2. In some embodiments, an organic light emitting device includes a first electrode, a second electrode, and an organic material layer having one or more layers provided between the first electrode and the second electrode, wherein the one or more layers comprise the coating composition or a cured product thereof.

Thermally conductive resin, resin composition, prepreg, and copper clad laminate

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is ##STR00001##
in which R.sup.1 is CH.sub.2, C(O), or (CH.sub.2)(C.sub.6H.sub.5), and R.sup.2 is H or CH.sub.3.

Thermally conductive resin, resin composition, prepreg, and copper clad laminate

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is ##STR00001##
in which R.sup.1 is CH.sub.2, C(O), or (CH.sub.2)(C.sub.6H.sub.5), and R.sup.2 is H or CH.sub.3.

Thermally conductive resin, resin composition, prepreg, and copper clad laminate

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is ##STR00001##
in which R.sup.1 is CH.sub.2, C(O), or (CH.sub.2)(C.sub.6H.sub.5), and R.sup.2 is H or CH.sub.3.