Provided are a lithographic printing plate precursor having an image-recording layer on a hydrophilic support, in which the image-recording layer includes a polymer particle including an addition polymerization-type resin having a hydrophilic structure and a crosslinking structure, a method for producing a lithographic printing plate in which the lithographic printing plate precursor is used, a polymer particle including an addition polymerization-type resin having a hydrophilic structure and a crosslinking structure, and a composition including the polymer particle.

A curable resin composition provides a cured resin product having excellent heat resistance and flame retardancy by curing. The curable resin composition includes a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a):

##STR00001##

where R.sup.1 to R.sup.7 each independently represent a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.1-2 alkoxy group, a C.sub.2-6 alkenyl group, or a hydroxy group, Y.sup.1 is an alkenyl group.

A curable resin composition provides a cured resin product having excellent heat resistance and flame retardancy by curing. The curable resin composition includes a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a):

##STR00001##

where R.sup.1 to R.sup.7 each independently represent a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.1-2 alkoxy group, a C.sub.2-6 alkenyl group, or a hydroxy group, Y.sup.1 is an alkenyl group.

A curable resin composition, which has excellent flowability and reactivity at the time of molding, with which a highly reliable cured product which has excellent heat resistance can be obtained by curing is provided. A curable resin composition comprising a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1):

##STR00001##

where R.sup.1 and R.sup.2 each independently represent a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.1-2 alkoxy group, or a hydroxy group, Q represents a C.sub.5-10 cycloalkylene group or a divalent organic group containing an alicyclic fused ring, and Y is an alkenyl group.

This disclosure relates to a film layer for use in flexible metal clad laminates. The film layer comprises a thermosetting composition comprising: a copolymer of (a) a diisoalkenylarene (DIAEA) and (b) a divinylarene (DVA) containing a mixture of m-divinylarene and p-divinylarene, in a mole ratio of (a) to (b) of 15:1 to 1:15; a second polymer; a filler and optional additives. Flexible metal clad laminates made with the film further comprises a metal foil bonded to the surface of the film. The thermosetting composition containing the DIAEA-DVA copolymer provides improved thermal stability at high temperature, excellent processability, and electrical properties, e.g., Dk and Df.

This disclosure relates to a film layer for use in flexible metal clad laminates. The film layer comprises a thermosetting composition comprising: a copolymer of (a) a diisoalkenylarene (DIAEA) and (b) a divinylarene (DVA) containing a mixture of m-divinylarene and p-divinylarene, in a mole ratio of (a) to (b) of 15:1 to 1:15; a second polymer; a filler and optional additives. Flexible metal clad laminates made with the film further comprises a metal foil bonded to the surface of the film. The thermosetting composition containing the DIAEA-DVA copolymer provides improved thermal stability at high temperature, excellent processability, and electrical properties, e.g., Dk and Df.

Embodiments of the present application relate to porous polymeric beads solid support for use in oligonucleotide synthesis and the method of producing and using the same. Further embodiments relate to porous polymeric beads and method for preparing and using the same.

Embodiments of the present application relate to porous polymeric beads solid support for use in oligonucleotide synthesis and the method of producing and using the same. Further embodiments relate to porous polymeric beads and method for preparing and using the same.

A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

An object of the present invention is to provide a mixture of cyclophosphazenes suitably substituted with phenoxy having a polymerizable functional group, such as allyl, on the phenyl ring and a production method for the mixture. The invention relates to a mixture of cyclophosphazene compounds that each contain a plurality of constituent units linked to each other, each constituent unit being represented by formula (I):

##STR00001##

wherein R.sup.1 and R.sup.2 are identical or different and represent C.sub.1-4 alkyl or the like, the mixture containing cyclophosphazene compounds in which 3, 4, and 5 constituent units represented by formula (I) are linked, wherein the cyclophosphazene compound containing 3 linked constituent units is cyclophosphazene compound (I-A) with a specific structure, compound (I-A) includes cyclophosphazene compounds (I-A2) and (I-A3) having a specific structure, and compounds (I-A2) and (I-A3) are present in an amount of 80 wt % or more in total in cyclophosphazene compound (I-A).