C08F212/34

THERMALLY CONDUCTIVE RESIN, RESIN COMPOSITION, PREPREG, AND COPPER CLAD LAMINATE

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is

##STR00001##

in which R.sup.1 is CH.sub.2, C(O), or (CH.sub.2)(C.sub.6H.sub.5), and R.sup.2 is H or CH.sub.3.

THERMALLY CONDUCTIVE RESIN, RESIN COMPOSITION, PREPREG, AND COPPER CLAD LAMINATE

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is

##STR00001##

in which R.sup.1 is CH.sub.2, C(O), or (CH.sub.2)(C.sub.6H.sub.5), and R.sup.2 is H or CH.sub.3.

Thermosetting resin composition, resin sheet, laminate, and printed wiring board

The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.

Thermosetting resin composition, resin sheet, laminate, and printed wiring board

The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C1) and a magnesium oxide filler (C2), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C1) and a magnesium oxide filler (C2), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

ENCAPSULANT COMPOSITION AND FILM

An encapsulant composition and a film are provided. The encapsulant composition includes 20-45 parts by weight of a component (A), 55-80 parts by weight of a component (B) and a component (C). The total weight of the component (A) and the component (B) is 100 parts by weight, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100. The component (A) includes first compound (A-1) and second compound (A-2), the component (B) is a non-modified inorganic powder or modified inorganic powder, and the component (C) is an initiator. The first compound (A-1) has structure represented by Formula (I) or Formula (II), and the second compound (A-2) is a monoalkenyl aromatic compound

##STR00001##

wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, a, b, c, d, e and f are as defined in the specification.

ENCAPSULANT COMPOSITION AND FILM

An encapsulant composition and a film are provided. The encapsulant composition includes 20-45 parts by weight of a component (A), 55-80 parts by weight of a component (B) and a component (C). The total weight of the component (A) and the component (B) is 100 parts by weight, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100. The component (A) includes first compound (A-1) and second compound (A-2), the component (B) is a non-modified inorganic powder or modified inorganic powder, and the component (C) is an initiator. The first compound (A-1) has structure represented by Formula (I) or Formula (II), and the second compound (A-2) is a monoalkenyl aromatic compound

##STR00001##

wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, a, b, c, d, e and f are as defined in the specification.

Polymer with blue light absorbing units chemically bonded to a polymeric backbone of the polymer

A process of forming a polymer with a blue light absorber chemically bonded to a polymeric backbone of the polymer includes mixing one or more olefin monomers with one or more functionalized p-vinylstyrylanthracene monomers to form a mixture of reactants. The mixture includes less than 10 percent by weight of the one or more functionalized p-vinylstyrylanthracene monomers. The process also includes polymerizing the mixture to produce a polymer with one or more blue light absorption characteristics.

Oxygen permeable polymers, ionomers and methods of making the same
10259894 · 2019-04-16 · ·

An oxygen permeable polymer has the following formula: ##STR00001##
wherein R.sub.S is a non-sulfonyl halide portion of a sulfonyl halide monomer or polymer; X.sub.P is NH or NHCO; A is an optionally substituted alkyl; L is 0, 1 or 2; m is 2 or 3; Z is H or CH.sub.3; and n is 5-m. The polymer can be used in air separation devices, air concentrators, and in electrodes for electrochemical devices.