Patent classifications
C08F232/08
METHODS OF MAKING A THREE-DIMENSIONAL OBJECT
Provided herein is method of making a three-dimensional object (31) by stereolithography, comprising: (a) providing a polymerizable liquid comprising: (i) a light polymerizable component; (ii) a cyclic olefin monomer and/or prepolymer, (iii) an inhibited ring-opening metathesis polymerization (ROMP) catalyst, and (iv) a photoinitiator; (b) producing a three-dimensional intermediate from said polymerizable liquid by stereolithography (11); (c) optionally cleaning (12) said intermediate; and (d) heating (13) a surface of said three-dimensional intermediate to activate the inhibited ROMP catalyst, polymerize the cyclic olefin monomer and/or prepolymer by frontal ring-opening metathesis polymerization and form said three-dimensional object. Resins, build platforms (20) and apparatus useful for performing the method are also provided.
Polymerization catalyst composition, polymer manufacturing method, polymer, rubber composition, and tire
To provide a catalyst composition having high polymerization activity. To provide a polymer manufacturing method. To provide a polymer manufactured by the polymer manufacturing method. To provide a rubber composition including the polymer. To provide a tire using the rubber composition. A catalyst composition including a compound represented by Structural Formula I below, wherein the compound has an OH group at at least one position of the bipyridyl ring; M is a transition metal, a lanthanoid, scandium, or yttrium; R.sup.1 and R.sup.2 are a hydrocarbon group having one or more carbon atoms or a halogen atom; and R.sup.1 and R.sup.2 may be the same or different from each other. A polymer manufacturing method including a step of polymerizing one or more selected from the group consisting of a conjugated diene compound and a compound having an ethylenically unsaturated double bond in the presence of the catalyst composition. A polymer manufactured by the manufacturing method. A rubber composition including the polymer. A tire using the rubber composition. ##STR00001##
Polymerization catalyst composition, polymer manufacturing method, polymer, rubber composition, and tire
To provide a catalyst composition having high polymerization activity. To provide a polymer manufacturing method. To provide a polymer manufactured by the polymer manufacturing method. To provide a rubber composition including the polymer. To provide a tire using the rubber composition. A catalyst composition including a compound represented by Structural Formula I below, wherein the compound has an OH group at at least one position of the bipyridyl ring; M is a transition metal, a lanthanoid, scandium, or yttrium; R.sup.1 and R.sup.2 are a hydrocarbon group having one or more carbon atoms or a halogen atom; and R.sup.1 and R.sup.2 may be the same or different from each other. A polymer manufacturing method including a step of polymerizing one or more selected from the group consisting of a conjugated diene compound and a compound having an ethylenically unsaturated double bond in the presence of the catalyst composition. A polymer manufactured by the manufacturing method. A rubber composition including the polymer. A tire using the rubber composition. ##STR00001##
Resin material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate
Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G′) curve and a loss modulus (G″) curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30° C. to 300° C., a heating rate of 3° C./min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40° C. and lower than or equal to 200°.
Resin material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate
Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G′) curve and a loss modulus (G″) curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30° C. to 300° C., a heating rate of 3° C./min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40° C. and lower than or equal to 200°.
Gels derived from poly(ethylidene norbornene)-b-poly(cyclopentene) block copolymer nanocomposites for viscosity modifications and drilling fluid applications
The present application is directed to a nanocomposite organo gel having a continuous polymeric network structure, wherein polymer chains are held together by ionic interaction between polymer chain ends, interparticle chain entanglements, layered silicate surface modifier, ionic salt, and layered silicate. The present application is also directed to methods of making and using the nanocomposite organo gel.
Gels derived from poly(ethylidene norbornene)-b-poly(cyclopentene) block copolymer nanocomposites for viscosity modifications and drilling fluid applications
The present application is directed to a nanocomposite organo gel having a continuous polymeric network structure, wherein polymer chains are held together by ionic interaction between polymer chain ends, interparticle chain entanglements, layered silicate surface modifier, ionic salt, and layered silicate. The present application is also directed to methods of making and using the nanocomposite organo gel.
ELASTIC MATERIALS PREPARED FROM ENERGY-CURABLE LIQUID COMPOSITIONS
An elastic material is provided having an elongation greater than 150% as measured according to ASTM D638-02a, a resiliency greater than 12% as measured according to ASTM D2632-01 (reapproved 2008), and a Shore A hardness of at least 10 as measured by ASTM D2240-15e1. The elastic material is an energy-cured reaction product of a curable composition that is a liquid at 25° C. The curable composition includes at least a) relatively high molecular weight (meth)acrylate-functionalized oligomer having no more than two (meth)acrylate functional groups per molecule on average; b) at least one mono(meth)acrylate-functionalized monomer having a molecular weight of less than 500 Daltons and a single (meth)acrylate functional group per molecule and/or an ethylenically unsaturated nitrogen-containing monomer; and c) at least one multi(meth)acrylate-functionalized monomer having a molecular weight of less than 1000 Daltons and at least two (meth)acrylate functional groups per molecule.
ELASTIC MATERIALS PREPARED FROM ENERGY-CURABLE LIQUID COMPOSITIONS
An elastic material is provided having an elongation greater than 150% as measured according to ASTM D638-02a, a resiliency greater than 12% as measured according to ASTM D2632-01 (reapproved 2008), and a Shore A hardness of at least 10 as measured by ASTM D2240-15e1. The elastic material is an energy-cured reaction product of a curable composition that is a liquid at 25° C. The curable composition includes at least a) relatively high molecular weight (meth)acrylate-functionalized oligomer having no more than two (meth)acrylate functional groups per molecule on average; b) at least one mono(meth)acrylate-functionalized monomer having a molecular weight of less than 500 Daltons and a single (meth)acrylate functional group per molecule and/or an ethylenically unsaturated nitrogen-containing monomer; and c) at least one multi(meth)acrylate-functionalized monomer having a molecular weight of less than 1000 Daltons and at least two (meth)acrylate functional groups per molecule.
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.