This invention provides a modified polyolefin resin composition that contains a large amount of an unsaturated carboxylic acid or an anhydride thereof, and that can inhibit an increase in fluidity after graft modification due to little influence of a reaction residue, wherein the resin composition when used as a compatibilizer for reinforced fiber plastics provides a molded article with excellent mechanical properties such as bending strength and impact resistance.

This invention provides a modified polyolefin resin composition that contains a large amount of an unsaturated carboxylic acid or an anhydride thereof, and that can inhibit an increase in fluidity after graft modification due to little influence of a reaction residue, wherein the resin composition when used as a compatibilizer for reinforced fiber plastics provides a molded article with excellent mechanical properties such as bending strength and impact resistance.

The invention relates to thermoplastic moulding materials comprising styrene block copolymers and propylene-based copolymers, wherein the SBC polymers comprise a styrene content of 5 to 40% by weight and the backbone of the propylene copolymers has a weight-average molecular weight M.sub.w<10 000 g/mol. The thermoplastic moulding materials are suitable for affixing granules due to their melt viscosity and their mechanical properties.

The invention relates to thermoplastic moulding materials comprising styrene block copolymers and propylene-based copolymers, wherein the SBC polymers comprise a styrene content of 5 to 40% by weight and the backbone of the propylene copolymers has a weight-average molecular weight M.sub.w<10 000 g/mol. The thermoplastic moulding materials are suitable for affixing granules due to their melt viscosity and their mechanical properties.

Crosslinkable insulation materials, which are commonly halogen-free, for use in wire and cable applications are provided. The insulation include a crosslinkable thermoplastic polymer and flame retardant material. The flame retardant material may include a metal hydroxide flame retardant, such as a magnesium, calcium, zinc and/or aluminum hydroxide. The crosslinkable thermoplastic polymer includes silane-grafted polymer blend, which includes a polyolefin plastomer blended with one or more other thermoplastic polymers. The crosslinkable thermoplastic polymer may be curable by exposure to moisture and may include moisture curable silane functionality in the crosslinkable thermoplastic polymer.

Crosslinkable insulation materials, which are commonly halogen-free, for use in wire and cable applications are provided. The insulation include a crosslinkable thermoplastic polymer and flame retardant material. The flame retardant material may include a metal hydroxide flame retardant, such as a magnesium, calcium, zinc and/or aluminum hydroxide. The crosslinkable thermoplastic polymer includes silane-grafted polymer blend, which includes a polyolefin plastomer blended with one or more other thermoplastic polymers. The crosslinkable thermoplastic polymer may be curable by exposure to moisture and may include moisture curable silane functionality in the crosslinkable thermoplastic polymer.

Crosslinkable insulation materials, which are commonly halogen-free, for use in wire and cable applications are provided. The insulation include a crosslinkable thermoplastic polymer and flame retardant material. The flame retardant material may include a metal hydroxide flame retardant, such as a magnesium, calcium, zinc and/or aluminum hydroxide. The crosslinkable thermoplastic polymer includes silane-grafted polymer blend, which includes a polyolefin plastomer blended with one or more other thermoplastic polymers. The crosslinkable thermoplastic polymer may be curable by exposure to moisture and may include moisture curable silane functionality in the crosslinkable thermoplastic polymer.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

A polymer blend is provided, which includes 100 parts by weight of a first polyolefin, 3 to 100 parts by weight of a thermoplastic polyurethane, and 3 to 10 parts by weight of a modified polyolefin. The modified polyolefin is formed by grafting maleic anhydride or acrylate onto a second polyolefin. The blend can be used to form fiber.