C08F265/02

ORGANIC POLYMERIC PARTICLES, PAPER COATING COMPOSITIONS, AND METHODS

Embodiments of the present disclosure include organic polymeric particles, paper coating compositions, coated paper, and methods of forming coated paper with the paper coating compositions. The embodiments of the organic polymeric particle include an organic hydrophilic polymer with a unit for hydrogen bonding, and a hollow porous structure that comprises an organic polymer that at least partially surrounds the organic hydrophilic polymer, where the hollow porous structure has a pore surface area greater than 1 percent of a total theoretical exterior surface area of the hollow porous structure and the organic hydrophilic polymer and the hollow porous structure give the organic polymeric particle a void volume fraction of 40 percent to 85 percent.

ORGANIC POLYMERIC PARTICLES, PAPER COATING COMPOSITIONS, AND METHODS

Embodiments of the present disclosure include organic polymeric particles, paper coating compositions, coated paper, and methods of forming coated paper with the paper coating compositions. The embodiments of the organic polymeric particle include an organic hydrophilic polymer with a unit for hydrogen bonding, and a hollow porous structure that comprises an organic polymer that at least partially surrounds the organic hydrophilic polymer, where the hollow porous structure has a pore surface area greater than 1 percent of a total theoretical exterior surface area of the hollow porous structure and the organic hydrophilic polymer and the hollow porous structure give the organic polymeric particle a void volume fraction of 40 percent to 85 percent.

ORGANIC POLYMERIC PARTICLES, PAPER COATING COMPOSITIONS, AND METHODS

Embodiments of the present disclosure include organic polymeric particles, paper coating compositions, coated paper, and methods of forming coated paper with the paper coating compositions. The embodiments of the organic polymeric particle include an organic hydrophilic polymer with a unit for hydrogen bonding, and a hollow porous structure that comprises an organic polymer that at least partially surrounds the organic hydrophilic polymer, where the hollow porous structure has a pore surface area greater than 1 percent of a total theoretical exterior surface area of the hollow porous structure and the organic hydrophilic polymer and the hollow porous structure give the organic polymeric particle a void volume fraction of 40 percent to 85 percent.

POLAR FUNCTIONAL NON-AQUEOUS ACRYLIC DISPERSIONS

Described herein is a polar non-aqueous dispersion comprising polar polymeric microparticles in a polar non-aqueous medium, the polar polymeric microparticles being insoluble in the medium and being produced by dispersion polymerization of vinyl monomers such as acrylate monomers in the medium in the presence of a polymeric acrylic stabilizer. Inks, coatings and overprint varnishes are formulated that employ the polar non-aqueous dispersion. Such inks, etc., exhibit superior chemical resistance properties, for example in one-part and two-part systems.

POLAR FUNCTIONAL NON-AQUEOUS ACRYLIC DISPERSIONS

Described herein is a polar non-aqueous dispersion comprising polar polymeric microparticles in a polar non-aqueous medium, the polar polymeric microparticles being insoluble in the medium and being produced by dispersion polymerization of vinyl monomers such as acrylate monomers in the medium in the presence of a polymeric acrylic stabilizer. Inks, coatings and overprint varnishes are formulated that employ the polar non-aqueous dispersion. Such inks, etc., exhibit superior chemical resistance properties, for example in one-part and two-part systems.

Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device

Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device. Disclosed is a resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, including a first resin having a radical reactive group in the side chain, a second resin containing at least one selected from a fluorine atom and a silicon atom, and a solvent. The second resin is preferably a resin containing a fluorine atom. The radical reactive group of the first resin is preferably a (meth)acryloyl group.

Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device

Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device. Disclosed is a resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, including a first resin having a radical reactive group in the side chain, a second resin containing at least one selected from a fluorine atom and a silicon atom, and a solvent. The second resin is preferably a resin containing a fluorine atom. The radical reactive group of the first resin is preferably a (meth)acryloyl group.

Chemical compositions and methods of patterning microelectronic device structures

A chemical composition includes a polymer chain having a surface anchoring group at a terminus of the polymer chain. The surface anchoring group is metal or dielectric selective and the polymer chain further includes at least one of a photo-acid generator, quencher, or a catalyst. In some embodiments, the surface anchoring group is metal selective or dielectric selective. In some embodiments, the polymer chain includes side polymer chains where the side polymer chains include polymers of photo-acid generators, quencher, or catalyst.

Chemical compositions and methods of patterning microelectronic device structures

A chemical composition includes a polymer chain having a surface anchoring group at a terminus of the polymer chain. The surface anchoring group is metal or dielectric selective and the polymer chain further includes at least one of a photo-acid generator, quencher, or a catalyst. In some embodiments, the surface anchoring group is metal selective or dielectric selective. In some embodiments, the polymer chain includes side polymer chains where the side polymer chains include polymers of photo-acid generators, quencher, or catalyst.

Oil soluble rheology modifying star macromolecules

Oil soluble rheology modifying star macromolecules having a core and five or more polymeric arms, and compositions comprising the same. The polymeric arms on a star are covalently attached to the core of the star; each polymeric arm comprises one or more (co)polymer segments; and at least one polymeric arm and/or at least one polymeric segment exhibits a different solubility from at least one other polymeric arm or one other polymeric segment, respectively, in a reference liquid of interest. The oil soluble rheology modifying star macromolecules and compositions comprising the same for use in oil based systems.